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Development of Quaternary InAlGaN Barrier Layer for High Electron Mobility Transistor Structures

A quaternary lattice matched InAlGaN barrier layer with am indium content of 16.5 ± 0.2% and thickness of 9 nm was developed for high electron mobility transistor structures using the metalorganic chemical-vapor deposition method. The structural, morphological, optical and electrical properties of t...

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Published in:Materials 2022-01, Vol.15 (3), p.1118
Main Authors: Jorudas, Justinas, Prystawko, Paweł, Šimukovič, Artūr, Aleksiejūnas, Ramūnas, Mickevičius, Jūras, Kryśko, Marcin, Michałowski, Paweł Piotr, Kašalynas, Irmantas
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Language:English
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Summary:A quaternary lattice matched InAlGaN barrier layer with am indium content of 16.5 ± 0.2% and thickness of 9 nm was developed for high electron mobility transistor structures using the metalorganic chemical-vapor deposition method. The structural, morphological, optical and electrical properties of the layer were investigated planning realization of microwave power and terahertz plasmonic devices. The measured X-ray diffraction and modeled band diagram characteristics revealed the structural parameters of the grown In Al Ga N/Al Ga N/GaN heterostructure, explaining the origin of barrier photoluminescence peak position at 3.98 eV with the linewidth of 0.2 eV and the expected red-shift of 0.4 eV only. The thermally stable density of the two-dimension electron gas at the depth of 10.5 nm was experimentally confirmed to be 1.2 × 10 cm (1.6 × 10 cm in theory) with the low-field mobility values of 1590 cm /(V·s) and 8830 cm /(V·s) at the temperatures of 300 K and 77 K, respectively.
ISSN:1996-1944
1996-1944
DOI:10.3390/ma15031118