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Conductivity Behaviour under Pressure of Copper Micro-Additive/Polyurethane Composites (Experimental and Modelling)
In this study, micro-size copper particles (less than 25 μm) were incorporated into polyurethane (PU) using a solution mixing method and spin-coating technique to fabricate composite films in concentrations from 0.5 to 20 vol.%. The conductivity behaviour of these composites under pressure was studi...
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Published in: | Polymers 2022-03, Vol.14 (7), p.1287 |
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description | In this study, micro-size copper particles (less than 25 μm) were incorporated into polyurethane (PU) using a solution mixing method and spin-coating technique to fabricate composite films in concentrations from 0.5 to 20 vol.%. The conductivity behaviour of these composites under pressure was studied experimentally and numerically. The conductivity measurements were performed in-plane and through-thickness under pressure. It was found that changes in conductivity only occurred in the z-direction under an applied pressure from 1 to 20 kPa. The results showed that pressure could induce conductivity up to about 7.2 × 10
S∙m
for composites with a Cu concentration higher than 2.6 vol.%. It seems that applied pressure reduced the thickness of the polymer film, decreasing the distance between copper particles and promoting the formation of a conductive network, thus making the material conductive. A semi-analytical model that can accurately provide the percolation threshold (PT) concentration was used to fit the experimental conductivity. The PT concentrations for PU-Cu composite ranged from 7.1 vol.% to 1.4 vol.% and decreased with the rise in pressure. This is known as a pressure-induced percolation transition phenomenon (PIPT). Finally, the finite element method based on the representative volume element model (FE-RVE) simulation technique was used to predict the conductivity behaviour. This numerical simulation provided a good description of the experimental conductivity after the PT and correctly predicted the PT concentration. This study shows that FE-RVE could be used to effectively simulate the influence of pressure on the electrical properties of a polymer-metal composite, reducing the need for costly and time-consuming experiments. |
doi_str_mv | 10.3390/polym14071287 |
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S∙m
for composites with a Cu concentration higher than 2.6 vol.%. It seems that applied pressure reduced the thickness of the polymer film, decreasing the distance between copper particles and promoting the formation of a conductive network, thus making the material conductive. A semi-analytical model that can accurately provide the percolation threshold (PT) concentration was used to fit the experimental conductivity. The PT concentrations for PU-Cu composite ranged from 7.1 vol.% to 1.4 vol.% and decreased with the rise in pressure. This is known as a pressure-induced percolation transition phenomenon (PIPT). Finally, the finite element method based on the representative volume element model (FE-RVE) simulation technique was used to predict the conductivity behaviour. This numerical simulation provided a good description of the experimental conductivity after the PT and correctly predicted the PT concentration. This study shows that FE-RVE could be used to effectively simulate the influence of pressure on the electrical properties of a polymer-metal composite, reducing the need for costly and time-consuming experiments.</description><identifier>ISSN: 2073-4360</identifier><identifier>EISSN: 2073-4360</identifier><identifier>DOI: 10.3390/polym14071287</identifier><identifier>PMID: 35406161</identifier><language>eng</language><publisher>Switzerland: MDPI AG</publisher><subject>Carbon fibers ; Composite materials ; Computer simulation ; Copper ; Electric properties ; Electrical properties ; Epoxy resins ; Finite element method ; Low density polyethylenes ; Mathematical models ; Nanomaterials ; Nanoparticles ; Nanowires ; Numerical analysis ; Particle size ; Percolation ; Polyethylene ; Polymer films ; Polymerization ; Polymers ; Polyurethane resins ; Polyurethanes ; Silver ; Simulation ; Spin coating ; Thickness</subject><ispartof>Polymers, 2022-03, Vol.14 (7), p.1287</ispartof><rights>COPYRIGHT 2022 MDPI AG</rights><rights>2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><rights>2022 by the authors. 2022</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c454t-95042fa16da5a6f1e1a7b15d6de8184ba4b439fb8a5d51739e7d4a374113c85a3</citedby><cites>FETCH-LOGICAL-c454t-95042fa16da5a6f1e1a7b15d6de8184ba4b439fb8a5d51739e7d4a374113c85a3</cites><orcidid>0000-0002-8221-7646</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.proquest.com/docview/2649122407/fulltextPDF?pq-origsite=primo$$EPDF$$P50$$Gproquest$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.proquest.com/docview/2649122407?pq-origsite=primo$$EHTML$$P50$$Gproquest$$Hfree_for_read</linktohtml><link.rule.ids>230,314,723,776,780,881,25731,27901,27902,36989,36990,44566,53766,53768,74869</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/35406161$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Mehvari, Saeid</creatorcontrib><creatorcontrib>Sanchez-Vicente, Yolanda</creatorcontrib><creatorcontrib>González, Sergio</creatorcontrib><creatorcontrib>Lafdi, Khalid</creatorcontrib><title>Conductivity Behaviour under Pressure of Copper Micro-Additive/Polyurethane Composites (Experimental and Modelling)</title><title>Polymers</title><addtitle>Polymers (Basel)</addtitle><description>In this study, micro-size copper particles (less than 25 μm) were incorporated into polyurethane (PU) using a solution mixing method and spin-coating technique to fabricate composite films in concentrations from 0.5 to 20 vol.%. The conductivity behaviour of these composites under pressure was studied experimentally and numerically. The conductivity measurements were performed in-plane and through-thickness under pressure. It was found that changes in conductivity only occurred in the z-direction under an applied pressure from 1 to 20 kPa. The results showed that pressure could induce conductivity up to about 7.2 × 10
S∙m
for composites with a Cu concentration higher than 2.6 vol.%. It seems that applied pressure reduced the thickness of the polymer film, decreasing the distance between copper particles and promoting the formation of a conductive network, thus making the material conductive. A semi-analytical model that can accurately provide the percolation threshold (PT) concentration was used to fit the experimental conductivity. The PT concentrations for PU-Cu composite ranged from 7.1 vol.% to 1.4 vol.% and decreased with the rise in pressure. This is known as a pressure-induced percolation transition phenomenon (PIPT). Finally, the finite element method based on the representative volume element model (FE-RVE) simulation technique was used to predict the conductivity behaviour. This numerical simulation provided a good description of the experimental conductivity after the PT and correctly predicted the PT concentration. This study shows that FE-RVE could be used to effectively simulate the influence of pressure on the electrical properties of a polymer-metal composite, reducing the need for costly and time-consuming experiments.</description><subject>Carbon fibers</subject><subject>Composite materials</subject><subject>Computer simulation</subject><subject>Copper</subject><subject>Electric properties</subject><subject>Electrical properties</subject><subject>Epoxy resins</subject><subject>Finite element method</subject><subject>Low density polyethylenes</subject><subject>Mathematical models</subject><subject>Nanomaterials</subject><subject>Nanoparticles</subject><subject>Nanowires</subject><subject>Numerical analysis</subject><subject>Particle size</subject><subject>Percolation</subject><subject>Polyethylene</subject><subject>Polymer films</subject><subject>Polymerization</subject><subject>Polymers</subject><subject>Polyurethane resins</subject><subject>Polyurethanes</subject><subject>Silver</subject><subject>Simulation</subject><subject>Spin coating</subject><subject>Thickness</subject><issn>2073-4360</issn><issn>2073-4360</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>PIMPY</sourceid><recordid>eNpdkk1v1DAQhi0EolXpkSuKxKUc0vrbyQVpu2oBqRU9wNly4smuq8QOcbJi_z1Dt1Qt9sHW-JnxOx-EvGf0XIiaXoyp3w9MUsN4ZV6RY06NKKXQ9PWz-xE5zfme4pJKa2bekiOhJNVMs2OS1yn6pZ3DLsz74hK2bhfSMhVL9DAVdxPkvExQpK5Yp3FE021op1SuvA_oAxd3qACBeesiIDKMKYcZcnF29RvpMECcXV-46Ivb5KHvQ9x8ekfedK7PcPp4npCf11c_1l_Lm-9fvq1XN2UrlZzLWlHJO8e0d8rpjgFzpmHKaw8Vq2TjZCNF3TWVU14xI2owXjphJGOirZQTJ-TzIe64NAP4FrVMrrcjynLT3iYX7MuXGLZ2k3a2ppQryTHA2WOAKf1aIM92CLnFLDDZtGTLtaxVzbUWiH78D73HMkZM74FinGOXkDo_UBvXgw2xS_hvi9vDENoUoQtoXxklKmmUqdChPDhg0XOeoHtSz6j9OwL2xQgg_-F5yk_0v4aLPw-OruU</recordid><startdate>20220323</startdate><enddate>20220323</enddate><creator>Mehvari, Saeid</creator><creator>Sanchez-Vicente, Yolanda</creator><creator>González, Sergio</creator><creator>Lafdi, Khalid</creator><general>MDPI AG</general><general>MDPI</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>7X8</scope><scope>5PM</scope><orcidid>https://orcid.org/0000-0002-8221-7646</orcidid></search><sort><creationdate>20220323</creationdate><title>Conductivity Behaviour under Pressure of Copper Micro-Additive/Polyurethane Composites (Experimental and Modelling)</title><author>Mehvari, Saeid ; Sanchez-Vicente, Yolanda ; González, Sergio ; Lafdi, Khalid</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c454t-95042fa16da5a6f1e1a7b15d6de8184ba4b439fb8a5d51739e7d4a374113c85a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Carbon fibers</topic><topic>Composite materials</topic><topic>Computer simulation</topic><topic>Copper</topic><topic>Electric properties</topic><topic>Electrical properties</topic><topic>Epoxy resins</topic><topic>Finite element method</topic><topic>Low density polyethylenes</topic><topic>Mathematical models</topic><topic>Nanomaterials</topic><topic>Nanoparticles</topic><topic>Nanowires</topic><topic>Numerical analysis</topic><topic>Particle size</topic><topic>Percolation</topic><topic>Polyethylene</topic><topic>Polymer films</topic><topic>Polymerization</topic><topic>Polymers</topic><topic>Polyurethane resins</topic><topic>Polyurethanes</topic><topic>Silver</topic><topic>Simulation</topic><topic>Spin coating</topic><topic>Thickness</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Mehvari, Saeid</creatorcontrib><creatorcontrib>Sanchez-Vicente, Yolanda</creatorcontrib><creatorcontrib>González, Sergio</creatorcontrib><creatorcontrib>Lafdi, Khalid</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Materials Science Collection</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>MEDLINE - Academic</collection><collection>PubMed Central (Full Participant titles)</collection><jtitle>Polymers</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Mehvari, Saeid</au><au>Sanchez-Vicente, Yolanda</au><au>González, Sergio</au><au>Lafdi, Khalid</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Conductivity Behaviour under Pressure of Copper Micro-Additive/Polyurethane Composites (Experimental and Modelling)</atitle><jtitle>Polymers</jtitle><addtitle>Polymers (Basel)</addtitle><date>2022-03-23</date><risdate>2022</risdate><volume>14</volume><issue>7</issue><spage>1287</spage><pages>1287-</pages><issn>2073-4360</issn><eissn>2073-4360</eissn><abstract>In this study, micro-size copper particles (less than 25 μm) were incorporated into polyurethane (PU) using a solution mixing method and spin-coating technique to fabricate composite films in concentrations from 0.5 to 20 vol.%. The conductivity behaviour of these composites under pressure was studied experimentally and numerically. The conductivity measurements were performed in-plane and through-thickness under pressure. It was found that changes in conductivity only occurred in the z-direction under an applied pressure from 1 to 20 kPa. The results showed that pressure could induce conductivity up to about 7.2 × 10
S∙m
for composites with a Cu concentration higher than 2.6 vol.%. It seems that applied pressure reduced the thickness of the polymer film, decreasing the distance between copper particles and promoting the formation of a conductive network, thus making the material conductive. A semi-analytical model that can accurately provide the percolation threshold (PT) concentration was used to fit the experimental conductivity. The PT concentrations for PU-Cu composite ranged from 7.1 vol.% to 1.4 vol.% and decreased with the rise in pressure. This is known as a pressure-induced percolation transition phenomenon (PIPT). Finally, the finite element method based on the representative volume element model (FE-RVE) simulation technique was used to predict the conductivity behaviour. This numerical simulation provided a good description of the experimental conductivity after the PT and correctly predicted the PT concentration. This study shows that FE-RVE could be used to effectively simulate the influence of pressure on the electrical properties of a polymer-metal composite, reducing the need for costly and time-consuming experiments.</abstract><cop>Switzerland</cop><pub>MDPI AG</pub><pmid>35406161</pmid><doi>10.3390/polym14071287</doi><orcidid>https://orcid.org/0000-0002-8221-7646</orcidid><oa>free_for_read</oa></addata></record> |
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subjects | Carbon fibers Composite materials Computer simulation Copper Electric properties Electrical properties Epoxy resins Finite element method Low density polyethylenes Mathematical models Nanomaterials Nanoparticles Nanowires Numerical analysis Particle size Percolation Polyethylene Polymer films Polymerization Polymers Polyurethane resins Polyurethanes Silver Simulation Spin coating Thickness |
title | Conductivity Behaviour under Pressure of Copper Micro-Additive/Polyurethane Composites (Experimental and Modelling) |
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