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Polyimide/graphene composite foam sheets with ultrahigh thermostability for electromagnetic interference shielding
Herein Kapton-type aromatic polyimide (PI) composite foams with reduced graphene oxide (rGO) content ranging from 1 to 16 wt% have been fabricated via a three-step method: in situ polymerization, nonsolvent induced phase separation and thermal imidization, and used for electromagnetic interference s...
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Published in: | RSC advances 2015-01, Vol.5 (31), p.24342-24351 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Herein Kapton-type aromatic polyimide (PI) composite foams with reduced graphene oxide (rGO) content ranging from 1 to 16 wt% have been fabricated
via
a three-step method:
in situ
polymerization, nonsolvent induced phase separation and thermal imidization, and used for electromagnetic interference shielding. The resultant PI/16 wt% rGO foam with low density of 0.28 g cm
−3
and thickness of 0.8 mm exhibited an effective EMI shielding effectiveness of 17-21 dB in X band (8-12 GHz). Additionally, the thermostability of the foams was also significantly enhanced, for the 5% weight loss temperature it was improved from 508 °C for the pure PI foam to 520 °C for the PI/1 wt% rGO foam, and consequently, to 581 °C for the PI/16 wt% rGO foam. Even with the high rGO content (16 wt%), the composite foam was fairly flexible. Tensile testing revealed that the PI/16 wt% rGO foam possessed a tensile strength of 11.4 MPa and an elongation at break of 9.6%, respectively.
Flexible PI/rGO composite foam sheets were fabricated
via
nonsolvent induced phase separation and exhibited effective EMI SE at low sample thickness. |
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ISSN: | 2046-2069 2046-2069 |
DOI: | 10.1039/c4ra16421k |