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Thermoelectric properties of Cu2Se1−xTex solid solutions
Binary Cu 2 Se and Cu 2 Te have gained great attention recently because of their interesting and abnormal physical properties, such as ultralow thermal conductivity, high carrier mobility, large effective mass of carriers and excellent thermoelectric performance. In this study, we find that these tw...
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Published in: | Journal of materials chemistry. A, Materials for energy and sustainability Materials for energy and sustainability, 2018, Vol.6 (16), p.6977-6986 |
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container_end_page | 6986 |
container_issue | 16 |
container_start_page | 6977 |
container_title | Journal of materials chemistry. A, Materials for energy and sustainability |
container_volume | 6 |
creator | Zhao, Kunpeng Guan, Mengjia Qiu, Pengfei Blichfeld, Anders B Eikeland, Espen Zhu, Chenxi Ren, Dudi Xu, Fangfang Iversen, Bo B Shi, Xun Chen, Lidong |
description | Binary Cu
2
Se and Cu
2
Te have gained great attention recently because of their interesting and abnormal physical properties, such as ultralow thermal conductivity, high carrier mobility, large effective mass of carriers and excellent thermoelectric performance. In this study, we find that these two compounds are completely miscible throughout the studied composition range. The trigonal structure of Cu
2
Se is maintained when the Te content
x
is 0.2, but a new trigonal structure is formed when the Te content
x
is between 0.3 and 0.7. The carrier concentration is greatly improved when increasing the Te content in Cu
2
Se
1−
x
Te
x
solid solutions, resulting in a much reduced electrical resistivity and Seebeck coefficient in the whole temperature range as compared with those of binary Cu
2
Se. The total thermal conductivity is inversely increased due to the contribution from enhanced carrier thermal conductivity. As a result, the overall thermoelectric performance of Cu
2
Se
1−
x
Te
x
solid solutions lies between Cu
2
Se and Cu
2
Te. We also find that the quality factor of Cu
2
Se
1−
x
Te
x
is higher than those of most typical thermoelectric materials. Thus the thermoelectric performance can be further improved if the intrinsically high hole carrier concentrations can be reduced in Cu
2
Se
1−
x
Te
x
.
We demonstrate that the quality factor of Cu
2
Se
1−
x
Te
x
solid solutions is higher than those of most typical thermoelectric materials. |
doi_str_mv | 10.1039/c8ta01313f |
format | article |
fullrecord | <record><control><sourceid>proquest_rsc_p</sourceid><recordid>TN_cdi_rsc_primary_c8ta01313f</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2030354036</sourcerecordid><originalsourceid>FETCH-LOGICAL-g268t-f7986ec2a33ede8b01c8d21f80cfe175209f2f7ddb6ab46b6f6402e96f1b00153</originalsourceid><addsrcrecordid>eNp9UE1LxDAUDKLgsu7Fu1DxXH1J2jTxJsUvWPBgPZc2edEu3U1NUlj_gWd_or_EyorefIf3BmaYNwwhxxTOKXB1oWVsgHLK7R6ZMcghLTIl9n-xlIdkEcIKppEAQqkZuaxe0K8d9qij73QyeDegjx2GxNmkHNkj0s_3j22F2yS4vjPfe4yd24QjcmCbPuDi587J0811Vd6ly4fb-_JqmT4zIWNqCyUFatZwjgZlC1RLw6iVoC3SImegLLOFMa1o2ky0wooMGCphaQtAcz4nZzvfKdvriCHWKzf6zfSyZsCB5xlwMalOdiofdD34bt34t_qvkYk__Y-vB2P5F2O3X7A</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2030354036</pqid></control><display><type>article</type><title>Thermoelectric properties of Cu2Se1−xTex solid solutions</title><source>Royal Society of Chemistry:Jisc Collections:Royal Society of Chemistry Read and Publish 2022-2024 (reading list)</source><creator>Zhao, Kunpeng ; Guan, Mengjia ; Qiu, Pengfei ; Blichfeld, Anders B ; Eikeland, Espen ; Zhu, Chenxi ; Ren, Dudi ; Xu, Fangfang ; Iversen, Bo B ; Shi, Xun ; Chen, Lidong</creator><creatorcontrib>Zhao, Kunpeng ; Guan, Mengjia ; Qiu, Pengfei ; Blichfeld, Anders B ; Eikeland, Espen ; Zhu, Chenxi ; Ren, Dudi ; Xu, Fangfang ; Iversen, Bo B ; Shi, Xun ; Chen, Lidong</creatorcontrib><description>Binary Cu
2
Se and Cu
2
Te have gained great attention recently because of their interesting and abnormal physical properties, such as ultralow thermal conductivity, high carrier mobility, large effective mass of carriers and excellent thermoelectric performance. In this study, we find that these two compounds are completely miscible throughout the studied composition range. The trigonal structure of Cu
2
Se is maintained when the Te content
x
is 0.2, but a new trigonal structure is formed when the Te content
x
is between 0.3 and 0.7. The carrier concentration is greatly improved when increasing the Te content in Cu
2
Se
1−
x
Te
x
solid solutions, resulting in a much reduced electrical resistivity and Seebeck coefficient in the whole temperature range as compared with those of binary Cu
2
Se. The total thermal conductivity is inversely increased due to the contribution from enhanced carrier thermal conductivity. As a result, the overall thermoelectric performance of Cu
2
Se
1−
x
Te
x
solid solutions lies between Cu
2
Se and Cu
2
Te. We also find that the quality factor of Cu
2
Se
1−
x
Te
x
is higher than those of most typical thermoelectric materials. Thus the thermoelectric performance can be further improved if the intrinsically high hole carrier concentrations can be reduced in Cu
2
Se
1−
x
Te
x
.
We demonstrate that the quality factor of Cu
2
Se
1−
x
Te
x
solid solutions is higher than those of most typical thermoelectric materials.</description><identifier>ISSN: 2050-7488</identifier><identifier>EISSN: 2050-7496</identifier><identifier>DOI: 10.1039/c8ta01313f</identifier><language>eng</language><publisher>Cambridge: Royal Society of Chemistry</publisher><subject>Carrier density ; Carrier mobility ; Copper selenides ; Electrical resistivity ; Heat conductivity ; Heat transfer ; Physical properties ; Q factors ; Seebeck effect ; Solid solutions ; Thermal conductivity ; Thermoelectric materials</subject><ispartof>Journal of materials chemistry. A, Materials for energy and sustainability, 2018, Vol.6 (16), p.6977-6986</ispartof><rights>Copyright Royal Society of Chemistry 2018</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,4022,27922,27923,27924</link.rule.ids></links><search><creatorcontrib>Zhao, Kunpeng</creatorcontrib><creatorcontrib>Guan, Mengjia</creatorcontrib><creatorcontrib>Qiu, Pengfei</creatorcontrib><creatorcontrib>Blichfeld, Anders B</creatorcontrib><creatorcontrib>Eikeland, Espen</creatorcontrib><creatorcontrib>Zhu, Chenxi</creatorcontrib><creatorcontrib>Ren, Dudi</creatorcontrib><creatorcontrib>Xu, Fangfang</creatorcontrib><creatorcontrib>Iversen, Bo B</creatorcontrib><creatorcontrib>Shi, Xun</creatorcontrib><creatorcontrib>Chen, Lidong</creatorcontrib><title>Thermoelectric properties of Cu2Se1−xTex solid solutions</title><title>Journal of materials chemistry. A, Materials for energy and sustainability</title><description>Binary Cu
2
Se and Cu
2
Te have gained great attention recently because of their interesting and abnormal physical properties, such as ultralow thermal conductivity, high carrier mobility, large effective mass of carriers and excellent thermoelectric performance. In this study, we find that these two compounds are completely miscible throughout the studied composition range. The trigonal structure of Cu
2
Se is maintained when the Te content
x
is 0.2, but a new trigonal structure is formed when the Te content
x
is between 0.3 and 0.7. The carrier concentration is greatly improved when increasing the Te content in Cu
2
Se
1−
x
Te
x
solid solutions, resulting in a much reduced electrical resistivity and Seebeck coefficient in the whole temperature range as compared with those of binary Cu
2
Se. The total thermal conductivity is inversely increased due to the contribution from enhanced carrier thermal conductivity. As a result, the overall thermoelectric performance of Cu
2
Se
1−
x
Te
x
solid solutions lies between Cu
2
Se and Cu
2
Te. We also find that the quality factor of Cu
2
Se
1−
x
Te
x
is higher than those of most typical thermoelectric materials. Thus the thermoelectric performance can be further improved if the intrinsically high hole carrier concentrations can be reduced in Cu
2
Se
1−
x
Te
x
.
We demonstrate that the quality factor of Cu
2
Se
1−
x
Te
x
solid solutions is higher than those of most typical thermoelectric materials.</description><subject>Carrier density</subject><subject>Carrier mobility</subject><subject>Copper selenides</subject><subject>Electrical resistivity</subject><subject>Heat conductivity</subject><subject>Heat transfer</subject><subject>Physical properties</subject><subject>Q factors</subject><subject>Seebeck effect</subject><subject>Solid solutions</subject><subject>Thermal conductivity</subject><subject>Thermoelectric materials</subject><issn>2050-7488</issn><issn>2050-7496</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNp9UE1LxDAUDKLgsu7Fu1DxXH1J2jTxJsUvWPBgPZc2edEu3U1NUlj_gWd_or_EyorefIf3BmaYNwwhxxTOKXB1oWVsgHLK7R6ZMcghLTIl9n-xlIdkEcIKppEAQqkZuaxe0K8d9qij73QyeDegjx2GxNmkHNkj0s_3j22F2yS4vjPfe4yd24QjcmCbPuDi587J0811Vd6ly4fb-_JqmT4zIWNqCyUFatZwjgZlC1RLw6iVoC3SImegLLOFMa1o2ky0wooMGCphaQtAcz4nZzvfKdvriCHWKzf6zfSyZsCB5xlwMalOdiofdD34bt34t_qvkYk__Y-vB2P5F2O3X7A</recordid><startdate>2018</startdate><enddate>2018</enddate><creator>Zhao, Kunpeng</creator><creator>Guan, Mengjia</creator><creator>Qiu, Pengfei</creator><creator>Blichfeld, Anders B</creator><creator>Eikeland, Espen</creator><creator>Zhu, Chenxi</creator><creator>Ren, Dudi</creator><creator>Xu, Fangfang</creator><creator>Iversen, Bo B</creator><creator>Shi, Xun</creator><creator>Chen, Lidong</creator><general>Royal Society of Chemistry</general><scope>7SP</scope><scope>7SR</scope><scope>7ST</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>C1K</scope><scope>JG9</scope><scope>L7M</scope><scope>SOI</scope></search><sort><creationdate>2018</creationdate><title>Thermoelectric properties of Cu2Se1−xTex solid solutions</title><author>Zhao, Kunpeng ; Guan, Mengjia ; Qiu, Pengfei ; Blichfeld, Anders B ; Eikeland, Espen ; Zhu, Chenxi ; Ren, Dudi ; Xu, Fangfang ; Iversen, Bo B ; Shi, Xun ; Chen, Lidong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-g268t-f7986ec2a33ede8b01c8d21f80cfe175209f2f7ddb6ab46b6f6402e96f1b00153</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Carrier density</topic><topic>Carrier mobility</topic><topic>Copper selenides</topic><topic>Electrical resistivity</topic><topic>Heat conductivity</topic><topic>Heat transfer</topic><topic>Physical properties</topic><topic>Q factors</topic><topic>Seebeck effect</topic><topic>Solid solutions</topic><topic>Thermal conductivity</topic><topic>Thermoelectric materials</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhao, Kunpeng</creatorcontrib><creatorcontrib>Guan, Mengjia</creatorcontrib><creatorcontrib>Qiu, Pengfei</creatorcontrib><creatorcontrib>Blichfeld, Anders B</creatorcontrib><creatorcontrib>Eikeland, Espen</creatorcontrib><creatorcontrib>Zhu, Chenxi</creatorcontrib><creatorcontrib>Ren, Dudi</creatorcontrib><creatorcontrib>Xu, Fangfang</creatorcontrib><creatorcontrib>Iversen, Bo B</creatorcontrib><creatorcontrib>Shi, Xun</creatorcontrib><creatorcontrib>Chen, Lidong</creatorcontrib><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Environment Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Environmental Sciences and Pollution Management</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Environment Abstracts</collection><jtitle>Journal of materials chemistry. A, Materials for energy and sustainability</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhao, Kunpeng</au><au>Guan, Mengjia</au><au>Qiu, Pengfei</au><au>Blichfeld, Anders B</au><au>Eikeland, Espen</au><au>Zhu, Chenxi</au><au>Ren, Dudi</au><au>Xu, Fangfang</au><au>Iversen, Bo B</au><au>Shi, Xun</au><au>Chen, Lidong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermoelectric properties of Cu2Se1−xTex solid solutions</atitle><jtitle>Journal of materials chemistry. A, Materials for energy and sustainability</jtitle><date>2018</date><risdate>2018</risdate><volume>6</volume><issue>16</issue><spage>6977</spage><epage>6986</epage><pages>6977-6986</pages><issn>2050-7488</issn><eissn>2050-7496</eissn><abstract>Binary Cu
2
Se and Cu
2
Te have gained great attention recently because of their interesting and abnormal physical properties, such as ultralow thermal conductivity, high carrier mobility, large effective mass of carriers and excellent thermoelectric performance. In this study, we find that these two compounds are completely miscible throughout the studied composition range. The trigonal structure of Cu
2
Se is maintained when the Te content
x
is 0.2, but a new trigonal structure is formed when the Te content
x
is between 0.3 and 0.7. The carrier concentration is greatly improved when increasing the Te content in Cu
2
Se
1−
x
Te
x
solid solutions, resulting in a much reduced electrical resistivity and Seebeck coefficient in the whole temperature range as compared with those of binary Cu
2
Se. The total thermal conductivity is inversely increased due to the contribution from enhanced carrier thermal conductivity. As a result, the overall thermoelectric performance of Cu
2
Se
1−
x
Te
x
solid solutions lies between Cu
2
Se and Cu
2
Te. We also find that the quality factor of Cu
2
Se
1−
x
Te
x
is higher than those of most typical thermoelectric materials. Thus the thermoelectric performance can be further improved if the intrinsically high hole carrier concentrations can be reduced in Cu
2
Se
1−
x
Te
x
.
We demonstrate that the quality factor of Cu
2
Se
1−
x
Te
x
solid solutions is higher than those of most typical thermoelectric materials.</abstract><cop>Cambridge</cop><pub>Royal Society of Chemistry</pub><doi>10.1039/c8ta01313f</doi><tpages>1</tpages></addata></record> |
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identifier | ISSN: 2050-7488 |
ispartof | Journal of materials chemistry. A, Materials for energy and sustainability, 2018, Vol.6 (16), p.6977-6986 |
issn | 2050-7488 2050-7496 |
language | eng |
recordid | cdi_rsc_primary_c8ta01313f |
source | Royal Society of Chemistry:Jisc Collections:Royal Society of Chemistry Read and Publish 2022-2024 (reading list) |
subjects | Carrier density Carrier mobility Copper selenides Electrical resistivity Heat conductivity Heat transfer Physical properties Q factors Seebeck effect Solid solutions Thermal conductivity Thermoelectric materials |
title | Thermoelectric properties of Cu2Se1−xTex solid solutions |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T09%3A27%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_rsc_p&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Thermoelectric%20properties%20of%20Cu2Se1%E2%88%92xTex%20solid%20solutions&rft.jtitle=Journal%20of%20materials%20chemistry.%20A,%20Materials%20for%20energy%20and%20sustainability&rft.au=Zhao,%20Kunpeng&rft.date=2018&rft.volume=6&rft.issue=16&rft.spage=6977&rft.epage=6986&rft.pages=6977-6986&rft.issn=2050-7488&rft.eissn=2050-7496&rft_id=info:doi/10.1039/c8ta01313f&rft_dat=%3Cproquest_rsc_p%3E2030354036%3C/proquest_rsc_p%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-g268t-f7986ec2a33ede8b01c8d21f80cfe175209f2f7ddb6ab46b6f6402e96f1b00153%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2030354036&rft_id=info:pmid/&rfr_iscdi=true |