Symmetrical magnet magnetron sputtering method for improving target utilization

A symmetrical magnet magnetron sputtering method, with one inner annular magnet and two outer annular magnets facing each other, has been developed. This magnetron cannot only deposit films at high rate but also greatly improves target utilization. The maximum deposition rate of Cu films was about 1...

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Bibliographic Details
Published in:Review of scientific instruments 1994-08, Vol.65 (8), p.2693-2695
Main Authors: Chen, Xiao‐hong, Fan, Qi‐hua, Chen, Hong‐you, Zhang, Ying
Format: Article
Language:English
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Summary:A symmetrical magnet magnetron sputtering method, with one inner annular magnet and two outer annular magnets facing each other, has been developed. This magnetron cannot only deposit films at high rate but also greatly improves target utilization. The maximum deposition rate of Cu films was about 11 000 Å/min. The target utilization efficiencies in the volume of the whole target body and in the area of the target plane were about 64% and 97.5%, respectively.
ISSN:0034-6748
1089-7623
DOI:10.1063/1.1144671