Analysis on the influential factors of Cu2+ electro-deposition

Electro-deposition is more commonly used as a method of copper surface treatment. Cu2+ concentration, current density and electro-deposition time play important roles in deposition mass. In this paper, the influence of Cu2+ concentration, current density and electro-deposition time on Cu deposition...

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Bibliographic Details
Main Authors: Sui, Xiuhua, Huang, Yunqian, Han, Tianyi, Zeng, Xianwei
Format: Conference Proceeding
Language:English
Subjects:
Copper
Current density
Deposition
Plasma
Regression analysis
Surface treatment
Online Access:Get full text
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Summary:Electro-deposition is more commonly used as a method of copper surface treatment. Cu2+ concentration, current density and electro-deposition time play important roles in deposition mass. In this paper, the influence of Cu2+ concentration, current density and electro-deposition time on Cu deposition mass was studied through regressive orthogonal experiment. The results show that Cu2+ concentration, current density and electro-deposition time have linear positive correlation and cross-effects on Cu deposition mass.
ISSN:0094-243X
1551-7616
DOI:10.1063/1.4979774