Microstructural and phase analysis of Sn-Cu-Ni-XSiC composite solder

The effect of ceramic addition on the Sn-Cu-Ni solder alloy microstructure has been investigated. Sn-Cu-Ni/SiC composite solder samples were fabricated via powder metallurgy (PM) techniques. In this study, five different SiC composition were chosen (0 wt. %, .25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0...

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Bibliographic Details
Main Authors: Ramli, M. I. I., Salleh, M. A. A. Mohd, Abdullah, M. M. Al Bakri, Said, R. M., Sandu, A. V., Saud, N.
Format: Conference Proceeding
Language:English
Subjects:
Copper
Grain boundaries
Metallurgical analysis
Microstructure
Nickel
Powder metallurgy
Silicon carbide
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Summary:The effect of ceramic addition on the Sn-Cu-Ni solder alloy microstructure has been investigated. Sn-Cu-Ni/SiC composite solder samples were fabricated via powder metallurgy (PM) techniques. In this study, five different SiC composition were chosen (0 wt. %, .25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). The results revealed that a small amount of SiC addition has well distributed along the grain boundaries which also refines the β-Sn phase.
ISSN:0094-243X
1551-7616
DOI:10.1063/1.4981848