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Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak
A new generation of millimeter-wave heterodyne imaging receiver arrays has been developed and demonstrated on the DIII-D electron cyclotron emission imaging (ECEI) system. Improved circuit integration, improved noise performance, and enhanced shielding from out-of-band emission are made possible by...
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Published in: | Review of scientific instruments 2018-10, Vol.89 (10), p.10H120-10H120 |
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creator | Zhu, Y. Ye, Y. Yu, J-H. Tobias, B. Pham, A-V. Wang, Y. Luo, C. Domier, C. W. Kramer, G. Ren, Y. Diallo, A. Nazikian, R. Chen, M. Yu, G. Luhmann, N. C. |
description | A new generation of millimeter-wave heterodyne imaging receiver arrays has been developed and demonstrated on the DIII-D electron cyclotron emission imaging (ECEI) system. Improved circuit integration, improved noise performance, and enhanced shielding from out-of-band emission are made possible by using advanced liquid crystal polymer (LCP) substrates and monolithic microwave integrated circuit (MMIC) receiver chips. This array exhibits ∼15 dB additional gain and >30× reduction in noise temperature compared to previous generation ECEI arrays. Each LCP horn-waveguide module houses a 3 × 3 mm GaAs MMIC receiver chip, which consists of a low noise millimeter-wave preamplifier, balanced mixer, and IF amplifier together with a local oscillator multiplier chain driven at ∼12 GHz. A proof-of-principle partial LCP instrument with 5 poloidal channels was installed on DIII-D in 2017, with a full proof-of-principle system (20 poloidal × 8 radial channels) installed and commissioned in early 2018. The enhanced shielding of the LCP modules is seen to greatly reduce the sensitivity of ECEI signals to out-of-band microwave noise which has plagued previous ECEI studies on DIII-D. The LCP ECEI system is expected to be a valuable diagnostic tool for pedestal region measurements, focusing particularly on electron temperature evolution during edge localized mode bursting. |
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W. ; Kramer, G. ; Ren, Y. ; Diallo, A. ; Nazikian, R. ; Chen, M. ; Yu, G. ; Luhmann, N. C.</creator><creatorcontrib>Zhu, Y. ; Ye, Y. ; Yu, J-H. ; Tobias, B. ; Pham, A-V. ; Wang, Y. ; Luo, C. ; Domier, C. W. ; Kramer, G. ; Ren, Y. ; Diallo, A. ; Nazikian, R. ; Chen, M. ; Yu, G. ; Luhmann, N. C. ; Princeton Plasma Physics Lab. (PPPL), Princeton, NJ (United States) ; Univ. of California, Davis, CA (United States)</creatorcontrib><description>A new generation of millimeter-wave heterodyne imaging receiver arrays has been developed and demonstrated on the DIII-D electron cyclotron emission imaging (ECEI) system. Improved circuit integration, improved noise performance, and enhanced shielding from out-of-band emission are made possible by using advanced liquid crystal polymer (LCP) substrates and monolithic microwave integrated circuit (MMIC) receiver chips. This array exhibits ∼15 dB additional gain and >30× reduction in noise temperature compared to previous generation ECEI arrays. Each LCP horn-waveguide module houses a 3 × 3 mm GaAs MMIC receiver chip, which consists of a low noise millimeter-wave preamplifier, balanced mixer, and IF amplifier together with a local oscillator multiplier chain driven at ∼12 GHz. A proof-of-principle partial LCP instrument with 5 poloidal channels was installed on DIII-D in 2017, with a full proof-of-principle system (20 poloidal × 8 radial channels) installed and commissioned in early 2018. The enhanced shielding of the LCP modules is seen to greatly reduce the sensitivity of ECEI signals to out-of-band microwave noise which has plagued previous ECEI studies on DIII-D. The LCP ECEI system is expected to be a valuable diagnostic tool for pedestal region measurements, focusing particularly on electron temperature evolution during edge localized mode bursting.</description><identifier>ISSN: 0034-6748</identifier><identifier>EISSN: 1089-7623</identifier><identifier>DOI: 10.1063/1.5035373</identifier><identifier>PMID: 30399858</identifier><identifier>CODEN: RSINAK</identifier><language>eng</language><publisher>United States: American Institute of Physics</publisher><subject>70 PLASMA PHYSICS AND FUSION TECHNOLOGY ; Arrays ; Channels ; Cyclotrons ; Diagnostic software ; Diagnostic systems ; DIII-D ; edge localized mode ; Electron Cyclotron Emission Imaging ; Electron Cyclotron Emission Imaging, DIII-D, monolithic microwave integrated circuit, edge localized mode ; Electron energy ; Emission ; Gallium arsenide ; Integrated circuits ; Intermediate frequency amplifiers ; Liquid crystal polymers ; Liquid crystals ; Low noise ; Millimeter waves ; MMIC (circuits) ; Modules ; monolithic microwave integrated circuit ; Noise ; Noise levels ; Noise reduction ; Noise temperature ; Polymers ; Scientific apparatus & instruments ; Shielding ; Substrates ; Tokamak devices</subject><ispartof>Review of scientific instruments, 2018-10, Vol.89 (10), p.10H120-10H120</ispartof><rights>Author(s)</rights><rights>2018 Author(s). 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W.</creatorcontrib><creatorcontrib>Kramer, G.</creatorcontrib><creatorcontrib>Ren, Y.</creatorcontrib><creatorcontrib>Diallo, A.</creatorcontrib><creatorcontrib>Nazikian, R.</creatorcontrib><creatorcontrib>Chen, M.</creatorcontrib><creatorcontrib>Yu, G.</creatorcontrib><creatorcontrib>Luhmann, N. C.</creatorcontrib><creatorcontrib>Princeton Plasma Physics Lab. (PPPL), Princeton, NJ (United States)</creatorcontrib><creatorcontrib>Univ. of California, Davis, CA (United States)</creatorcontrib><title>Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak</title><title>Review of scientific instruments</title><addtitle>Rev Sci Instrum</addtitle><description>A new generation of millimeter-wave heterodyne imaging receiver arrays has been developed and demonstrated on the DIII-D electron cyclotron emission imaging (ECEI) system. Improved circuit integration, improved noise performance, and enhanced shielding from out-of-band emission are made possible by using advanced liquid crystal polymer (LCP) substrates and monolithic microwave integrated circuit (MMIC) receiver chips. This array exhibits ∼15 dB additional gain and >30× reduction in noise temperature compared to previous generation ECEI arrays. Each LCP horn-waveguide module houses a 3 × 3 mm GaAs MMIC receiver chip, which consists of a low noise millimeter-wave preamplifier, balanced mixer, and IF amplifier together with a local oscillator multiplier chain driven at ∼12 GHz. A proof-of-principle partial LCP instrument with 5 poloidal channels was installed on DIII-D in 2017, with a full proof-of-principle system (20 poloidal × 8 radial channels) installed and commissioned in early 2018. The enhanced shielding of the LCP modules is seen to greatly reduce the sensitivity of ECEI signals to out-of-band microwave noise which has plagued previous ECEI studies on DIII-D. The LCP ECEI system is expected to be a valuable diagnostic tool for pedestal region measurements, focusing particularly on electron temperature evolution during edge localized mode bursting.</description><subject>70 PLASMA PHYSICS AND FUSION TECHNOLOGY</subject><subject>Arrays</subject><subject>Channels</subject><subject>Cyclotrons</subject><subject>Diagnostic software</subject><subject>Diagnostic systems</subject><subject>DIII-D</subject><subject>edge localized mode</subject><subject>Electron Cyclotron Emission Imaging</subject><subject>Electron Cyclotron Emission Imaging, DIII-D, monolithic microwave integrated circuit, edge localized mode</subject><subject>Electron energy</subject><subject>Emission</subject><subject>Gallium arsenide</subject><subject>Integrated circuits</subject><subject>Intermediate frequency amplifiers</subject><subject>Liquid crystal polymers</subject><subject>Liquid crystals</subject><subject>Low noise</subject><subject>Millimeter waves</subject><subject>MMIC (circuits)</subject><subject>Modules</subject><subject>monolithic microwave integrated circuit</subject><subject>Noise</subject><subject>Noise levels</subject><subject>Noise reduction</subject><subject>Noise temperature</subject><subject>Polymers</subject><subject>Scientific apparatus & instruments</subject><subject>Shielding</subject><subject>Substrates</subject><subject>Tokamak devices</subject><issn>0034-6748</issn><issn>1089-7623</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNp9kU9v1DAQxS1ERZeFA18AWXABpBQ7E8f2EbX8WWmlXuBseZ1J6zaJt7ZTab893u5SJJDqy7zDT88z7xHyhrMzzlr4zM8EAwESnpEFZ0pXsq3hOVkwBk3Vykadkpcp3bDyBOcvyCkw0FoJtSC49nez76iLu5TtQLdh2I0YaUSH_r6IMXTzgIn2IVIc0OUYJup2bggPCkefki_Cj_bKT1e0yHyN9GK1WlUXNIdbO9rbV-Skt0PC18e5JL--ff15_qNaX35fnX9ZV65pRK7aTnIQlruusQ7auu7rziL0vdaOAci-1RvGGgRopdyUDZlwtmuh1tpijRaW5N3BN6TsTXI-o7t2YZrK3oY3SjKtCvThAG1juJsxZVNucDgMdsIwJ1NzYIoxVTJckvf_oDdhjlM5oVBcCiUY3xt-PFAuhpQi9mYbSxxxZzgz-4IMN8eCCvv26DhvRuweyT-NFODTAdhvb3OJ9pG5D_Gvk9l2_VPw_1__Bj9bpjM</recordid><startdate>20181001</startdate><enddate>20181001</enddate><creator>Zhu, Y.</creator><creator>Ye, Y.</creator><creator>Yu, J-H.</creator><creator>Tobias, B.</creator><creator>Pham, A-V.</creator><creator>Wang, Y.</creator><creator>Luo, C.</creator><creator>Domier, C. W.</creator><creator>Kramer, G.</creator><creator>Ren, Y.</creator><creator>Diallo, A.</creator><creator>Nazikian, R.</creator><creator>Chen, M.</creator><creator>Yu, G.</creator><creator>Luhmann, N. C.</creator><general>American Institute of Physics</general><general>American Institute of Physics (AIP)</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><scope>7X8</scope><scope>OIOZB</scope><scope>OTOTI</scope><orcidid>https://orcid.org/0000-0002-0002-5342</orcidid><orcidid>https://orcid.org/0000-0002-8080-7773</orcidid><orcidid>https://orcid.org/0000000200025342</orcidid><orcidid>https://orcid.org/0000000280807773</orcidid></search><sort><creationdate>20181001</creationdate><title>Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak</title><author>Zhu, Y. ; Ye, Y. ; Yu, J-H. ; Tobias, B. ; Pham, A-V. ; Wang, Y. ; Luo, C. ; Domier, C. 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(PPPL), Princeton, NJ (United States)</aucorp><aucorp>Univ. of California, Davis, CA (United States)</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak</atitle><jtitle>Review of scientific instruments</jtitle><addtitle>Rev Sci Instrum</addtitle><date>2018-10-01</date><risdate>2018</risdate><volume>89</volume><issue>10</issue><spage>10H120</spage><epage>10H120</epage><pages>10H120-10H120</pages><issn>0034-6748</issn><eissn>1089-7623</eissn><coden>RSINAK</coden><abstract>A new generation of millimeter-wave heterodyne imaging receiver arrays has been developed and demonstrated on the DIII-D electron cyclotron emission imaging (ECEI) system. Improved circuit integration, improved noise performance, and enhanced shielding from out-of-band emission are made possible by using advanced liquid crystal polymer (LCP) substrates and monolithic microwave integrated circuit (MMIC) receiver chips. This array exhibits ∼15 dB additional gain and >30× reduction in noise temperature compared to previous generation ECEI arrays. Each LCP horn-waveguide module houses a 3 × 3 mm GaAs MMIC receiver chip, which consists of a low noise millimeter-wave preamplifier, balanced mixer, and IF amplifier together with a local oscillator multiplier chain driven at ∼12 GHz. A proof-of-principle partial LCP instrument with 5 poloidal channels was installed on DIII-D in 2017, with a full proof-of-principle system (20 poloidal × 8 radial channels) installed and commissioned in early 2018. The enhanced shielding of the LCP modules is seen to greatly reduce the sensitivity of ECEI signals to out-of-band microwave noise which has plagued previous ECEI studies on DIII-D. The LCP ECEI system is expected to be a valuable diagnostic tool for pedestal region measurements, focusing particularly on electron temperature evolution during edge localized mode bursting.</abstract><cop>United States</cop><pub>American Institute of Physics</pub><pmid>30399858</pmid><doi>10.1063/1.5035373</doi><tpages>5</tpages><orcidid>https://orcid.org/0000-0002-0002-5342</orcidid><orcidid>https://orcid.org/0000-0002-8080-7773</orcidid><orcidid>https://orcid.org/0000000200025342</orcidid><orcidid>https://orcid.org/0000000280807773</orcidid><oa>free_for_read</oa></addata></record> |
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subjects | 70 PLASMA PHYSICS AND FUSION TECHNOLOGY Arrays Channels Cyclotrons Diagnostic software Diagnostic systems DIII-D edge localized mode Electron Cyclotron Emission Imaging Electron Cyclotron Emission Imaging, DIII-D, monolithic microwave integrated circuit, edge localized mode Electron energy Emission Gallium arsenide Integrated circuits Intermediate frequency amplifiers Liquid crystal polymers Liquid crystals Low noise Millimeter waves MMIC (circuits) Modules monolithic microwave integrated circuit Noise Noise levels Noise reduction Noise temperature Polymers Scientific apparatus & instruments Shielding Substrates Tokamak devices |
title | Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak |
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