Novel mask-less plating metallization route for bifacial silicon heterojunction solar cells

The proof of concept of a novel metallization route for bifacial silicon heterojunction (SHJ) solar cells by selective plating – i.e. organic mask-free, is demonstrated by a first lab scale solar cell (η=15.5%). A patterned metal-seed is inkjet-printed or deposited by PVD on a PVD-Al layer covering...

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Bibliographic Details
Main Authors: Hatt, Thibaud, Mehta, Vivek P., Bartsch, Jonas, Kluska, Sven, Jahn, Mike, Borchert, Dietmar, Glatthaar, Markus
Format: Conference Proceeding
Language:English
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Summary:The proof of concept of a novel metallization route for bifacial silicon heterojunction (SHJ) solar cells by selective plating – i.e. organic mask-free, is demonstrated by a first lab scale solar cell (η=15.5%). A patterned metal-seed is inkjet-printed or deposited by PVD on a PVD-Al layer covering the ITO layer. The copper electroplating process is investigated considering different electrolytes and plating settings in order to selectively cover the metal-seed and not the PVD Al layer. As well a processing chemistry to etch the PVD-Al layer without affecting the ITO and the electroplated contact is presented.
ISSN:0094-243X
1551-7616
DOI:10.1063/1.5049272