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Optimization of warpage on front panel housing part using response surface methodology (RSM)
Warpage is one of the common defect that occur during the injection molding process and one of the causes was process condition or parameter setting. The minimization of warpage in x and y direction were studied by going through a few stages of simulation using Integrating Finite Element (FE) Analys...
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Main Authors: | , , , , , |
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Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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Summary: | Warpage is one of the common defect that occur during the injection molding process and one of the causes was process condition or parameter setting. The minimization of warpage in x and y direction were studied by going through a few stages of simulation using Integrating Finite Element (FE) Analysis, Moldflow analysis and Response Surface Methodology (RSM). The plastic part that examines in this study was front panel housing part with a thickness of 2.5 mm. There were four parameters that were selected by reviewing the previous research study, which were melt temperature, packing time, cooling time and packing pressure. All these parameters were combined and analyzed by conduct a two full factorial experimental design in Design Expert software. The FE analysis result obtains via analysis of variance (ANOVA) method was run as to determine the percentage contribution among these four parameters toward the warpage occur. |
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ISSN: | 0094-243X 1551-7616 |
DOI: | 10.1063/1.5066794 |