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Thermo-mechanical analysis of various solder materials via finite element method

The thermal environment may cause the unintended thermal stress to the solder joint which could lead to the reliability issue. This study aims to study the temperature cycling analysis of various solder materials (i.e., Sn-58Bi, Sn- 3.5Ag and Sn-9Zn) by using the finite element method. A leadless so...

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Main Authors:	Khor, C. Y., Termizi, S. N. A. Ahmad, Ishak, Muhammad Ikman, Hissam, M. I. B., Ani, F. Che
Format:	Conference Proceeding
Language:	English
Subjects:	Cycles Finite element analysis Finite element method Lead free Reliability analysis Soldered joints Strain Thermal environments Thermal stress Thermomechanical analysis Three dimensional models Tin base alloys
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creator	Khor, C. Y. Termizi, S. N. A. Ahmad Ishak, Muhammad Ikman Hissam, M. I. B. Ani, F. Che
description	The thermal environment may cause the unintended thermal stress to the solder joint which could lead to the reliability issue. This study aims to study the temperature cycling analysis of various solder materials (i.e., Sn-58Bi, Sn- 3.5Ag and Sn-9Zn) by using the finite element method. A leadless solder joint of the surface mount component was considered and the three-dimensional model was created in the simulation software. The thermo-mechanical aspects (i.e., maximum displacement, stress and strain) of lead-free solder materials were investigated. The simulation results revealed the solder material significantly affects the thermo-mechanical aspects during the temperature cycling test. The maximum stress of the leadless solder joint was concentrated around the interface region of the solder and pad. The lowest stress (195MPa) was noticed on the solder joint when the Sn-58Bi material was applied. This study is expected to provide the understanding of the thermo-mechanical aspects of various solder materials during the temperature cycling test.
doi_str_mv	10.1063/5.0022812
format	conference_proceeding
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Y. ; Termizi, S. N. A. Ahmad ; Ishak, Muhammad Ikman ; Hissam, M. I. B. ; Ani, F. Che</creator><contributor>Abdullah, Mohd Mustafa Al Bakri ; Tahir, Muhammad Faheem Mohd ; Mortar, Nurul Aida Mohd ; Saad, Mohd Nasir Mat ; Rahim, Shayfull Zamree Abd</contributor><creatorcontrib>Khor, C. Y. ; Termizi, S. N. A. Ahmad ; Ishak, Muhammad Ikman ; Hissam, M. I. B. ; Ani, F. Che ; Abdullah, Mohd Mustafa Al Bakri ; Tahir, Muhammad Faheem Mohd ; Mortar, Nurul Aida Mohd ; Saad, Mohd Nasir Mat ; Rahim, Shayfull Zamree Abd</creatorcontrib><description>The thermal environment may cause the unintended thermal stress to the solder joint which could lead to the reliability issue. This study aims to study the temperature cycling analysis of various solder materials (i.e., Sn-58Bi, Sn- 3.5Ag and Sn-9Zn) by using the finite element method. A leadless solder joint of the surface mount component was considered and the three-dimensional model was created in the simulation software. The thermo-mechanical aspects (i.e., maximum displacement, stress and strain) of lead-free solder materials were investigated. The simulation results revealed the solder material significantly affects the thermo-mechanical aspects during the temperature cycling test. The maximum stress of the leadless solder joint was concentrated around the interface region of the solder and pad. The lowest stress (195MPa) was noticed on the solder joint when the Sn-58Bi material was applied. 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Che</creatorcontrib><title>Thermo-mechanical analysis of various solder materials via finite element method</title><title>AIP conference proceedings</title><description>The thermal environment may cause the unintended thermal stress to the solder joint which could lead to the reliability issue. This study aims to study the temperature cycling analysis of various solder materials (i.e., Sn-58Bi, Sn- 3.5Ag and Sn-9Zn) by using the finite element method. A leadless solder joint of the surface mount component was considered and the three-dimensional model was created in the simulation software. The thermo-mechanical aspects (i.e., maximum displacement, stress and strain) of lead-free solder materials were investigated. The simulation results revealed the solder material significantly affects the thermo-mechanical aspects during the temperature cycling test. The maximum stress of the leadless solder joint was concentrated around the interface region of the solder and pad. The lowest stress (195MPa) was noticed on the solder joint when the Sn-58Bi material was applied. This study is expected to provide the understanding of the thermo-mechanical aspects of various solder materials during the temperature cycling test.</description><subject>Cycles</subject><subject>Finite element analysis</subject><subject>Finite element method</subject><subject>Lead free</subject><subject>Reliability analysis</subject><subject>Soldered joints</subject><subject>Strain</subject><subject>Thermal environments</subject><subject>Thermal stress</subject><subject>Thermomechanical analysis</subject><subject>Three dimensional models</subject><subject>Tin base alloys</subject><issn>0094-243X</issn><issn>1551-7616</issn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2020</creationdate><recordtype>conference_proceeding</recordtype><recordid>eNp90E1LAzEQBuAgCtbqwX8Q8CZsnSSbZPcoxS8o6KGCtxA3szRld7MmaaH_3hUL3mQOw8DDy_AScs1gwUCJO7kA4Lxi_ITMmJSs0IqpUzIDqMuCl-LjnFyktJ1QrXU1I2_rDcY-FD02Gzv4xnbUDrY7JJ9oaOneRh92iabQOYy0txmjt12ie29p6wefkWKHPQ6Z9pg3wV2Ss3YCeHXcc_L--LBePher16eX5f2qGJmqcsFri84pyZVttWNSl-iwBtYoBroExZ20yEE0omIOWl1DrUBNl0N0n1yIObn5zR1j-NphymYbdnF6PRleSiW1mmZSt78qNT7b7MNgxuh7Gw-GgflpzEhzbOw_vA_xD5rRteIbfO5sUg</recordid><startdate>20201102</startdate><enddate>20201102</enddate><creator>Khor, C. Y.</creator><creator>Termizi, S. N. A. Ahmad</creator><creator>Ishak, Muhammad Ikman</creator><creator>Hissam, M. I. B.</creator><creator>Ani, F. Che</creator><general>American Institute of Physics</general><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20201102</creationdate><title>Thermo-mechanical analysis of various solder materials via finite element method</title><author>Khor, C. Y. ; Termizi, S. N. A. Ahmad ; Ishak, Muhammad Ikman ; Hissam, M. I. B. ; Ani, F. 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Che</creatorcontrib><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Khor, C. Y.</au><au>Termizi, S. N. A. Ahmad</au><au>Ishak, Muhammad Ikman</au><au>Hissam, M. I. B.</au><au>Ani, F. Che</au><au>Abdullah, Mohd Mustafa Al Bakri</au><au>Tahir, Muhammad Faheem Mohd</au><au>Mortar, Nurul Aida Mohd</au><au>Saad, Mohd Nasir Mat</au><au>Rahim, Shayfull Zamree Abd</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Thermo-mechanical analysis of various solder materials via finite element method</atitle><btitle>AIP conference proceedings</btitle><date>2020-11-02</date><risdate>2020</risdate><volume>2291</volume><issue>1</issue><issn>0094-243X</issn><eissn>1551-7616</eissn><coden>APCPCS</coden><abstract>The thermal environment may cause the unintended thermal stress to the solder joint which could lead to the reliability issue. This study aims to study the temperature cycling analysis of various solder materials (i.e., Sn-58Bi, Sn- 3.5Ag and Sn-9Zn) by using the finite element method. A leadless solder joint of the surface mount component was considered and the three-dimensional model was created in the simulation software. The thermo-mechanical aspects (i.e., maximum displacement, stress and strain) of lead-free solder materials were investigated. The simulation results revealed the solder material significantly affects the thermo-mechanical aspects during the temperature cycling test. The maximum stress of the leadless solder joint was concentrated around the interface region of the solder and pad. The lowest stress (195MPa) was noticed on the solder joint when the Sn-58Bi material was applied. This study is expected to provide the understanding of the thermo-mechanical aspects of various solder materials during the temperature cycling test.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/5.0022812</doi><tpages>6</tpages></addata></record>
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source	American Institute of Physics:Jisc Collections:Transitional Journals Agreement 2021-23 (Reading list)
subjects	Cycles Finite element analysis Finite element method Lead free Reliability analysis Soldered joints Strain Thermal environments Thermal stress Thermomechanical analysis Three dimensional models Tin base alloys
title	Thermo-mechanical analysis of various solder materials via finite element method
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