Conformal metal thin-film coatings in high-aspect-ratio trenches using a self-sputtered rf-driven plasma source

A thin-film coating system has been developed for the deposition of both conductive and insulating materials. The system employs a radio-frequency (rf)-discharge plasma source with four straight rf antennas, which is made of or covered with the deposition material, thus serving simultaneously as a s...

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Bibliographic Details
Published in:Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena Microelectronics and nanometer structures processing, measurement and phenomena, 2007-07, Vol.25 (4), p.1227-1230
Main Authors: Ji, L., Kim, J.-K., Ji, Q., Leung, K.-N., Chen, Y., Gough, R. A.
Format: Article
Language:English
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Summary:A thin-film coating system has been developed for the deposition of both conductive and insulating materials. The system employs a radio-frequency (rf)-discharge plasma source with four straight rf antennas, which is made of or covered with the deposition material, thus serving simultaneously as a sputtering target. The average deposition rate of the copper thin film can be as high as 500 nm ∕ min when operated under continuous-wave mode. Film properties under different operating conditions (gas pressure and rf power) have been investigated experimentally. Three thin-film coating schemes have been developed, one of which has been demonstrated to be suitable for conformal deep-trench coating. Conformal coating over trenches of high-aspect ratio ( > 6 : 1 ) has been demonstrated at both micron and submicron scales.
ISSN:1071-1023
1520-8567
DOI:10.1116/1.2749527