Direct simulation Monte Carlo modeling of e-beam metal deposition

Three-dimensional direct simulation Monte Carlo (DSMC) method is applied here to model the electron-beam physical vapor deposition of copper thin films. Various molecular models for copper-copper interactions have been considered and a suitable molecular model has been determined based on comparison...

Full description

Saved in:
Bibliographic Details
Published in:Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vacuum, surfaces, and films, 2010-07, Vol.28 (4), p.916-924
Main Authors: Venkattraman, A., Alexeenko, A. A.
Format: Article
Language:English
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c382t-97764803fd637e3235765412dcf6dccd7b0d5e04ed2c3a93c3c11f4461d415373
cites cdi_FETCH-LOGICAL-c382t-97764803fd637e3235765412dcf6dccd7b0d5e04ed2c3a93c3c11f4461d415373
container_end_page 924
container_issue 4
container_start_page 916
container_title Journal of vacuum science & technology. A, Vacuum, surfaces, and films
container_volume 28
creator Venkattraman, A.
Alexeenko, A. A.
description Three-dimensional direct simulation Monte Carlo (DSMC) method is applied here to model the electron-beam physical vapor deposition of copper thin films. Various molecular models for copper-copper interactions have been considered and a suitable molecular model has been determined based on comparisons of dimensional mass fluxes obtained from simulations and previous experiments. The variable hard sphere model that is determined for atomic copper vapor can be used in DSMC simulations for design and analysis of vacuum deposition systems, allowing for accurate prediction of growth rates, uniformity, and microstructure.
doi_str_mv 10.1116/1.3386592
format article
fullrecord <record><control><sourceid>scitation_cross</sourceid><recordid>TN_cdi_scitation_primary_10_1116_1_3386592Direct_simulation_Mo</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>scitation_primary_10_1116_1_3386592</sourcerecordid><originalsourceid>FETCH-LOGICAL-c382t-97764803fd637e3235765412dcf6dccd7b0d5e04ed2c3a93c3c11f4461d415373</originalsourceid><addsrcrecordid>eNp9kEtLAzEUhYMoWKsL_0G2ClNz85zZCKU-ocWNrkOah0RmmpKMgv_e1il0IXV1N9_9OOcgdAlkAgDyBiaM1VI09AiNQFBS1UI0x2hEFOMVBQKn6KyUD0IIpUSO0PQuZm97XGL32Zo-phVepFXv8czkNuEuOd_G1TtOAftq6U2HO9-bFju_TiVu-XN0Ekxb_MXujtHbw_3r7Kmavzw-z6bzyrKa9lWjlOQ1YcFJpjyjTCgpOFBng3TWOrUkTnjCvaOWmYZZZgEC5xIcB8EUG6OrwWtzKiX7oNc5diZ_ayB6212D3nXfsLcDW2zsf1sdhocB9H4AvUgbwfUhwVfK-2e9duE_-G-0H4qWfIE</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Direct simulation Monte Carlo modeling of e-beam metal deposition</title><source>American Institute of Physics:Jisc Collections:Transitional Journals Agreement 2021-23 (Reading list)</source><creator>Venkattraman, A. ; Alexeenko, A. A.</creator><creatorcontrib>Venkattraman, A. ; Alexeenko, A. A.</creatorcontrib><description>Three-dimensional direct simulation Monte Carlo (DSMC) method is applied here to model the electron-beam physical vapor deposition of copper thin films. Various molecular models for copper-copper interactions have been considered and a suitable molecular model has been determined based on comparisons of dimensional mass fluxes obtained from simulations and previous experiments. The variable hard sphere model that is determined for atomic copper vapor can be used in DSMC simulations for design and analysis of vacuum deposition systems, allowing for accurate prediction of growth rates, uniformity, and microstructure.</description><identifier>ISSN: 0734-2101</identifier><identifier>EISSN: 1520-8559</identifier><identifier>DOI: 10.1116/1.3386592</identifier><identifier>CODEN: JVTAD6</identifier><language>eng</language><publisher>American Vacuum Society</publisher><ispartof>Journal of vacuum science &amp; technology. A, Vacuum, surfaces, and films, 2010-07, Vol.28 (4), p.916-924</ispartof><rights>American Vacuum Society</rights><rights>2010 American Vacuum Society</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c382t-97764803fd637e3235765412dcf6dccd7b0d5e04ed2c3a93c3c11f4461d415373</citedby><cites>FETCH-LOGICAL-c382t-97764803fd637e3235765412dcf6dccd7b0d5e04ed2c3a93c3c11f4461d415373</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Venkattraman, A.</creatorcontrib><creatorcontrib>Alexeenko, A. A.</creatorcontrib><title>Direct simulation Monte Carlo modeling of e-beam metal deposition</title><title>Journal of vacuum science &amp; technology. A, Vacuum, surfaces, and films</title><description>Three-dimensional direct simulation Monte Carlo (DSMC) method is applied here to model the electron-beam physical vapor deposition of copper thin films. Various molecular models for copper-copper interactions have been considered and a suitable molecular model has been determined based on comparisons of dimensional mass fluxes obtained from simulations and previous experiments. The variable hard sphere model that is determined for atomic copper vapor can be used in DSMC simulations for design and analysis of vacuum deposition systems, allowing for accurate prediction of growth rates, uniformity, and microstructure.</description><issn>0734-2101</issn><issn>1520-8559</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><recordid>eNp9kEtLAzEUhYMoWKsL_0G2ClNz85zZCKU-ocWNrkOah0RmmpKMgv_e1il0IXV1N9_9OOcgdAlkAgDyBiaM1VI09AiNQFBS1UI0x2hEFOMVBQKn6KyUD0IIpUSO0PQuZm97XGL32Zo-phVepFXv8czkNuEuOd_G1TtOAftq6U2HO9-bFju_TiVu-XN0Ekxb_MXujtHbw_3r7Kmavzw-z6bzyrKa9lWjlOQ1YcFJpjyjTCgpOFBng3TWOrUkTnjCvaOWmYZZZgEC5xIcB8EUG6OrwWtzKiX7oNc5diZ_ayB6212D3nXfsLcDW2zsf1sdhocB9H4AvUgbwfUhwVfK-2e9duE_-G-0H4qWfIE</recordid><startdate>20100701</startdate><enddate>20100701</enddate><creator>Venkattraman, A.</creator><creator>Alexeenko, A. A.</creator><general>American Vacuum Society</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20100701</creationdate><title>Direct simulation Monte Carlo modeling of e-beam metal deposition</title><author>Venkattraman, A. ; Alexeenko, A. A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c382t-97764803fd637e3235765412dcf6dccd7b0d5e04ed2c3a93c3c11f4461d415373</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Venkattraman, A.</creatorcontrib><creatorcontrib>Alexeenko, A. A.</creatorcontrib><collection>CrossRef</collection><jtitle>Journal of vacuum science &amp; technology. A, Vacuum, surfaces, and films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Venkattraman, A.</au><au>Alexeenko, A. A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Direct simulation Monte Carlo modeling of e-beam metal deposition</atitle><jtitle>Journal of vacuum science &amp; technology. A, Vacuum, surfaces, and films</jtitle><date>2010-07-01</date><risdate>2010</risdate><volume>28</volume><issue>4</issue><spage>916</spage><epage>924</epage><pages>916-924</pages><issn>0734-2101</issn><eissn>1520-8559</eissn><coden>JVTAD6</coden><abstract>Three-dimensional direct simulation Monte Carlo (DSMC) method is applied here to model the electron-beam physical vapor deposition of copper thin films. Various molecular models for copper-copper interactions have been considered and a suitable molecular model has been determined based on comparisons of dimensional mass fluxes obtained from simulations and previous experiments. The variable hard sphere model that is determined for atomic copper vapor can be used in DSMC simulations for design and analysis of vacuum deposition systems, allowing for accurate prediction of growth rates, uniformity, and microstructure.</abstract><pub>American Vacuum Society</pub><doi>10.1116/1.3386592</doi><tpages>9</tpages><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 0734-2101
ispartof Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2010-07, Vol.28 (4), p.916-924
issn 0734-2101
1520-8559
language eng
recordid cdi_scitation_primary_10_1116_1_3386592Direct_simulation_Mo
source American Institute of Physics:Jisc Collections:Transitional Journals Agreement 2021-23 (Reading list)
title Direct simulation Monte Carlo modeling of e-beam metal deposition
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T13%3A15%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-scitation_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Direct%20simulation%20Monte%20Carlo%20modeling%20of%20e-beam%20metal%20deposition&rft.jtitle=Journal%20of%20vacuum%20science%20&%20technology.%20A,%20Vacuum,%20surfaces,%20and%20films&rft.au=Venkattraman,%20A.&rft.date=2010-07-01&rft.volume=28&rft.issue=4&rft.spage=916&rft.epage=924&rft.pages=916-924&rft.issn=0734-2101&rft.eissn=1520-8559&rft.coden=JVTAD6&rft_id=info:doi/10.1116/1.3386592&rft_dat=%3Cscitation_cross%3Escitation_primary_10_1116_1_3386592%3C/scitation_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c382t-97764803fd637e3235765412dcf6dccd7b0d5e04ed2c3a93c3c11f4461d415373%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true