Transfer free suspended graphene devices on silicon using electrodeposited copper

• Published in: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 2014-01, Vol.32 (1)
• Main Authors: Krishna Bharadwaj, B., Pratap, Rudra, Raghavan, Srinivasan
• Format: Article
• Language: English
• ISSN: 2166-2746; 1520-8567; 2166-2754
• DOI: 10.1116/1.4862154

Transfer free processes using Cu films greatly simplify the fabrication of reliable suspended graphene devices. In this paper, the authors report on the use of electrodeposited Cu films on Si for transfer free fabrication of suspended graphene devices. The quality of graphene layers on optimized electrodeposited Cu and Cu foil are found to be the same. By selectively etching the underlying Cu, the authors have realized by a transfer free process metal contacted, suspended graphene beams up to 50 μm in length directly on Si. The suspended graphene beams do not show any increase in defect levels over the as grown state indicating the efficiency of the transfer free process. Measured room temperature electronic mobilities of up to 5200 cm2/V·s show that this simpler and CMOS compatible route has the potential to replace the foil based route for such suspended nano and micro electromechanical device arrays.