Stable yttrium oxyfluoride used in plasma process chamber

An yttrium oxyfluoride (YOF) protective material was developed for the inner wall of plasma process equipment. Using microwave-excited surface-wave high-density plasma equipment, the chemical stability of the obtained YOF films was evaluated by exposure to H2/Ar, N2/Ar, NH3/Ar, O2/Ar, and NF3/Ar pla...

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Bibliographic Details
Published in:Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vacuum, surfaces, and films, 2017-03, Vol.35 (2)
Main Authors: Shiba, Yoshinobu, Teramoto, Akinobu, Goto, Tetsuya, Kishi, Yukio, Shirai, Yasuyuki, Sugawa, Shigetoshi
Format: Article
Language:English
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Summary:An yttrium oxyfluoride (YOF) protective material was developed for the inner wall of plasma process equipment. Using microwave-excited surface-wave high-density plasma equipment, the chemical stability of the obtained YOF films was evaluated by exposure to H2/Ar, N2/Ar, NH3/Ar, O2/Ar, and NF3/Ar plasmas. The YOF film surface was stable against these plasmas containing hydrogen, nitrogen, oxygen, and fluorine. Especially, the stability of YOF against fluoridation was better than that of Y2O3, which is currently widely used as the protective material in plasma process chambers.
ISSN:0734-2101
1520-8559
DOI:10.1116/1.4975143