Optimization and kinetics of copper cementation from bio-leachate generated during the waste printed circuit board (E-waste) processing

The leach solutions of waste printed circuit boards contain a variety of base as well as precious metals with different concentrations. So, it is necessary to recover such metals for downstream processing of leach solutions. Cementation process is widely used at the industrial scale due to lower ope...

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Published in:Environmental Sustainability 2019-12, Vol.2 (4), p.391-399
Main Authors: Sodha, Asha B., Tipre, Devayani R., Dave, Shailesh R.
Format: Article
Language:English
Subjects:
Aluminum
Cementation
Cementing
Circuit boards
Climate Change
Copper
Diffusion rate
Earth and Environmental Science
Electronic waste
Environment
Environmental Management
Heavy metals
Iron
Kinetics
Leachates
Metal concentrations
Metals
Methods
Natural Resources
Original Article
Plating
Printed circuits
Process parameters
Recovery
Scanning electron microscopy
Scrap iron
Spectrum analysis
Sustainable Development
X ray powder diffraction
X-ray spectroscopy
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description The leach solutions of waste printed circuit boards contain a variety of base as well as precious metals with different concentrations. So, it is necessary to recover such metals for downstream processing of leach solutions. Cementation process is widely used at the industrial scale due to lower operational cost. In the present study, recovery of copper was performed by scrap iron and aluminium as cementing agents. Use of scrap iron resulted in a 99% copper recovery. Effects of different process parameters were studied to achieve maximum copper recovery. Kinetic study of copper cementation showed that the rate-controlling step was diffusion and the activation energy was 38.83 kJ/mol. Using flask data, the scale-up study was carried out with scrap iron for 8 L of the pregnant bio-leach solution. Complete recovery of copper was achieved within 120 min of reaction time in the scale-up study. The purity of recovered copper was 93% after the recovery process. Scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM- EDX) and X-ray powder diffraction (XRD) analysis of recovered copper was performed to characterize the recovered metal. Graphic abstract
doi_str_mv 10.1007/s42398-019-00084-y
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Scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM- EDX) and X-ray powder diffraction (XRD) analysis of recovered copper was performed to characterize the recovered metal. 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source Springer Nature
subjects Aluminum
Cementation
Cementing
Circuit boards
Climate Change
Copper
Diffusion rate
Earth and Environmental Science
Electronic waste
Environment
Environmental Management
Heavy metals
Iron
Kinetics
Leachates
Metal concentrations
Metals
Methods
Natural Resources
Original Article
Plating
Printed circuits
Process parameters
Recovery
Scanning electron microscopy
Scrap iron
Spectrum analysis
Sustainable Development
X ray powder diffraction
X-ray spectroscopy
title Optimization and kinetics of copper cementation from bio-leachate generated during the waste printed circuit board (E-waste) processing
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