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Microelectronic Packaging: Methods of housing, cooling and interconnecting the sllicon chips in a digital computer have an important bearing on the machine's performance. The aim is to fit the most chips in the least volume
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Published in: | Scientific American 1983-07, Vol.249 (1), p.86 |
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Main Author: | |
Format: | Magazinearticle |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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ISSN: | 0036-8733 |
DOI: | 10.1038/scientificamerican0783-86 |