Microelectronic Packaging: Methods of housing, cooling and interconnecting the sllicon chips in a digital computer have an important bearing on the machine's performance. The aim is to fit the most chips in the least volume

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Published in:Scientific American 1983-07, Vol.249 (1), p.86
Main Author: Albert J. Blodgett
Format: Magazinearticle
Language:English
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Technology
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creator Albert J. Blodgett
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doi_str_mv 10.1038/scientificamerican0783-86
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source JSTOR Archival Journals and Primary Sources Collection
subjects Technology
title Microelectronic Packaging: Methods of housing, cooling and interconnecting the sllicon chips in a digital computer have an important bearing on the machine's performance. The aim is to fit the most chips in the least volume
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