Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in gl...

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Bibliographic Details
Published in:IEEE access 2018-01, Vol.6, p.44306-44317
Main Authors: Laakso, Miku J., Bleiker, Simon J., Liljeholm, Jessica, Martensson, Gustaf E., Asiatici, Mikhail, Fischer, Andreas C., Stemme, Goran, Ebefors, Thorbjorn, Niklaus, Frank
Format: Article
Language:English
Subjects:
Assembling
Assembly
Chip scale packaging
Electronic packaging
Electroplating
femtosecond laser
Glass
glass interposer
Glass substrates
laser ablation
Magnetomechanical effects
Manufacturing engineering
Metals
Microelectromechanical systems
Micromechanical devices
multichip modules
Packaging
robotic assembly
self-assembly
Silicon
spin-on glass
Substrates
thermal expansion
through-glass via
through-silicon vias
TSV
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Summary:A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64~ \text {m} \Omega , which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods.
ISSN:2169-3536
2169-3536
DOI:10.1109/ACCESS.2018.2861886