The strength of surface micromachined indium phosphide devices evaluated by Weibull analysis of tensile and bending tests

The strength of beams surface micromachined from InP was evaluated by subjecting the beams to bending and tensile tests. The tests were performed with a testing unit mounted on a micromanipulator adapted for an SEM to facilitate in situ testing. The tests

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Bibliographic Details
Published in:Sensors and materials 1999, Vol.11 (4), p.247-256
Main Authors: GREEK, S, SEASSAL, C, VIKTOROVITCH, P, HJORT, K
Format: Article
Language:English
Subjects:
Applied sciences
Balance systems, tensile machines, etc
Electronics
Exact sciences and technology
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Lithography, masks and pattern transfer
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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Description
Summary:The strength of beams surface micromachined from InP was evaluated by subjecting the beams to bending and tensile tests. The tests were performed with a testing unit mounted on a micromanipulator adapted for an SEM to facilitate in situ testing. The tests
ISSN:0914-4935
2435-0869