Wrinkling and Growth Mechanism of CuO Nanowires in Thermal Oxidation of Copper Foil

• Published in: Chinese journal of chemical physics 2013-10, Vol.26 (5), p.585-589
• Main Authors: Lai, Fa‐chun, Lin, Suan‐zhi, Chen, Zhi‐gao, Hu, Hai‐long, Lin, Li‐mei
• Format: Article
• Language: English
• Subjects: 氧化时间; 氧化铜; 热氧化; 生长机制; 电场强度; 皱纹; 纳米线; 铜箔
• ISSN: 1674-0068; 2327-2244
• DOI: 10.1063/1674-0068/26/05/585-589

We report a systematic study on wrinkling and CuO nanowires （NWs） growth in the thermal oxidation of copper foil. Copper foils with thickness of 0.5 mm were thermally oxidized in air at 500℃ for 0.5-10 h. It is found that all the samples have wrinkles and the size of the wrinkles increases with the oxidation time increasing. CuO NWs can grow on both the sidehill and hilltop of wrinkle. The CuO NWs on sidehill are longer and denser than those on hilltop. The growth direction of the CuO NWs on sidehill is not vertical to the substrate but vertical to their growth surfaces. The process of wrinkling and CuO NWs growth can be divided into three stages： undulating, voiding, and cracking. The CuO NWs on both sidehill and hilltop grow at the undulating stage. However, only the CuO NWs on sidehill grow and those on hilltop stop growing at the voiding and cracking stages because of the void in hilltop. The local electric field in a wrinkle at undulating stage was calculated, and it is found that the difference of local electric field strengths between hilltop and sidehill is small, which indicates that the predominant driving force for the diffusion of Cu ion during CuO NWs growth is internal stress.