Comparison of microstructures in electroformed and spin-formed copper liners of shaped charge undergone high-strain-rate deformation

• Published in: Transactions of Nonferrous Metals Society of China 2007-12, Vol.17 (6), p.1447-1450
• Main Author: 范爱玲 李树奎 田文怀 王富耻
• Format: Article
• Language: English
• Subjects: copper liners; dynamic recovery and recrystallization; high-strain-rate deformation; microstructures; 动态恢复; 微观结构; 高疲劳率变形
• ISSN: 1003-6326
• DOI: 10.1016/S1003-6326(07)60292-1

The as-formed and post-deformed microstructures in both electroformed and spin-formed copper liners of shaped charge were studied by optical microscopy（OM）, electron backscattering Kikuchi patterns（EBSP） technique and transmission electron microscopy（TEM）. The deformation was carried out at an ultra-high strain rate. OM analysis shows that the initial grains of the electroformed copper liner are finer than those of the spin-formed copper liners. Meanwhile, EBSP analysis reveals that the fiber texture exists in the electroformed copper liners, whereas there is no texture observed in the spin-formed copper liners before deformation. Having undergone high-strain-rate deformation the grains in the recovered slugs, which are transformed from both the electroformed and spin-formed copper liners, all become small. TEM observations of the above two kinds of post-deformed specimens show the existence of cellular structures characterized by tangled dislocations and subgrain boundaries consisting of dislocation arrays. These experimental results indicate that dynamic recovery and recrystallization play an important role in the high-strain-rate deformation process.