Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate

The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs direct...

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Bibliographic Details
Published in:Transactions of Nonferrous Metals Society of China 2008-02, Vol.18 (1), p.132-137
Main Author: 田艳红 王春青 Y. Norman ZHOU
Format: Article
Language:English
Subjects:
bonding mechanism
copper wire
ultrasonic wedge bonding
wear action
磨损性能
超声波焊接
金属学
铜导线
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Summary:The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing. The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible, and the wedge bonding is achieved by wear action induced by ultrasonic vibration. The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.
ISSN:1003-6326
DOI:10.1016/S1003-6326(08)60024-2