Effect of Zn addition in Sn-rich alloys on interfacial reaction with Au foils

To restrain the formation of AuSn x intermetallic components (IMCs) in solder joints, Zn was added into Sn-rich solders. The solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125 °C. The results show that the total thickness of AuSn x IMCs at the interface...

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Bibliographic Details
Published in:Transactions of Nonferrous Metals Society of China 2008-06, Vol.18 (3), p.617-622
Main Authors: LIU, Wei, WANG, Chun-qing, TIAN, Yan-hong, CHEN, Ya-rong
Format: Article
Language:English
Subjects:
interfacial reaction
intermetallic compounds
Zn addition
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Summary:To restrain the formation of AuSn x intermetallic components (IMCs) in solder joints, Zn was added into Sn-rich solders. The solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125 °C. The results show that the total thickness of AuSn x IMCs at the interface of pure Sn solder and Au foils reaches about 54 μm under the condition of 600 h aging. In Sn-1.5Zn solder joints, however, formation of AuSn 4 IMCs is restrained greatly. As the content of Zn in the solder is increased to 3.5%(mass fraction), no AuSn 4 IMC is observed at the interface. Au-Zn phases form beside AuSn 2 and AuSn IMCs layers. As for Sn-9.0Zn solder joints, Au-Zn and Au-Zn-Sn phases and few AuSn x IMCs form at the interface. Moreover, total thickness of the phases and IMCs is far less than that of AuSn x IMCs in the pure Sn solder joints.
ISSN:1003-6326
DOI:10.1016/S1003-6326(08)60107-7