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Three-dimensional high-isolated dual-band balun using double-sided parallel-strip line with inserted conductor plane
A novel three-dimensional high-isolated dual-band balun is proposed for the first time. A horizontal feeding plane, a vertically mounted plane, and four grounded resistors constitute the entire structure. By introducing the double-sided parallel-strip line with an inserted conductor plane to the mid...
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Published in: | Electronics letters 2017-08, Vol.53 (17), p.1211-1213 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Request full text |
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Summary: | A novel three-dimensional high-isolated dual-band balun is proposed for the first time. A horizontal feeding plane, a vertically mounted plane, and four grounded resistors constitute the entire structure. By introducing the double-sided parallel-strip line with an inserted conductor plane to the middle of the vertical plane, the output matching and isolation, frequency-independent phase difference, and complete ground in the bottom layer of the horizontal plane are perfectly integrated in this novel balun. To prove this conception, a practical balun operating at 1.3/2.5 GHz is designed. As expected, remarkable consistency between the simulation and measurement is obtained. |
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ISSN: | 0013-5194 1350-911X 1350-911X |
DOI: | 10.1049/el.2017.1954 |