Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang. technology and applications in surface mount, hybrid circuits, and component assembly /

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Bibliographic Details
Main Author: Hwang, Jennie S.
Format: Book
Language:English
Published: New York : Van Nostrand Reinhold, c1989
Subjects:
Printed circuits > Design and construction
Solder pastes
Surface mount technology
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089 |a 621.38174 
100 1 |a Hwang, Jennie S. 
245 1 0 |a Solder paste in electronics packaging :  |b technology and applications in surface mount, hybrid circuits, and component assembly /  |c Jennie S. Hwang. 
260 |a New York :  |b Van Nostrand Reinhold,  |c c1989 
504 |a Includes bibliographies and index 
650 0 0 |a Printed circuits  |x Design and construction 
650 0 0 |a Solder pastes 
650 0 0 |a Surface mount technology 
952 |0 0  |1 0  |4 0  |6 621_381740000000000_HWA  |7 0  |9 268379  |a PILKINGTON  |b PILKINGTON  |c MAIN  |d 1994-02-23  |l 23  |o 621.38174/HWA  |p 0400203480  |r 2020-08-10 00:00:00  |s 2020-07-20  |w 2018-02-01  |y LONG 
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942 0 0 |0 1 

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