Thermal stress and strain in microelectronics packaging / edited by John H. Lau..

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Bibliographic Details
Other Authors: Lau, John H.
Format: Book
Language:English
Published: New York : Van Nostrand Reinhold, c1993
Subjects:
Electronic packaging
Microelectronic packaging
Thermal stresses
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LEADER 00000nxm-a2200000zn-4500
001 000332852
005 20180201111948.0
008 940104s1993----en-a----W----00-----eng--
015 |a b9404316 
020 |a 0442010583 
082 0 4 |a 621.381046  |2 20 
089 |a 621.381046 
089 |a 621.3817 
089 |a 621.38173 
245 0 0 |a Thermal stress and strain in microelectronics packaging /  |c edited by John H. Lau.. 
260 |a New York :  |b Van Nostrand Reinhold,  |c c1993 
300 |a xxii, 883 p 
650 0 0 |a Electronic packaging 
650 0 0 |a Microelectronic packaging 
650 0 0 |a Thermal stresses 
700 1 |a Lau, John H. 
952 |0 0  |1 0  |4 0  |6 621_381046000000000_THE  |7 0  |9 453188  |a PILKINGTON  |b PILKINGTON  |c MAIN  |d 1994-04-05  |l 26  |o 621.381046/THE  |p 040088514X  |r 2014-06-06 00:00:00  |w 2018-02-01  |y LONG 
999 |c 285863  |d 285863 

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