IEEE Components, Hybrids, and Manufacturing Technology Society, & Morris, J. E. (1994). Electronics packaging forum : multichip module technology issues / edited by James E. Morris: Multichip module technology issues. IEEE Press.
Chicago Style (17th ed.) CitationIEEE Components, Hybrids, and Manufacturing Technology Society, and James E. Morris. Electronics Packaging Forum : Multichip Module Technology Issues / Edited by James E. Morris: Multichip Module Technology Issues. Piscataway, N.J.: IEEE Press, 1994.
MLA (9th ed.) CitationIEEE Components, Hybrids, and Manufacturing Technology Society, and James E. Morris. Electronics Packaging Forum : Multichip Module Technology Issues / Edited by James E. Morris: Multichip Module Technology Issues. IEEE Press, 1994.
Warning: These citations may not always be 100% accurate.