Tummala, R. R., Rymaszewski, E. J., & Klopfenstein, A. G. (1996). Microelectronics packaging handbook edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (2nd ed.). Chapman & Hall.
Chicago Style (17th ed.) CitationTummala, Rao R., Eugene J. Rymaszewski, and Alan G. Klopfenstein. Microelectronics Packaging Handbook Edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein. 2nd ed. London: Chapman & Hall, 1996.
MLA (9th ed.) CitationTummala, Rao R., et al. Microelectronics Packaging Handbook Edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein. 2nd ed. Chapman & Hall, 1996.
Warning: These citations may not always be 100% accurate.