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Chip scale package (CSP) : design, materials, processes, reliability, and applications / John Lau, Shi-Wei Ricky Lee. design, materials, processes, reliability, and applications /

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Bibliographic Details
Main Author:	Lau, John H.
Other Authors:	Lee, Shi-Wei Ricky
Format:	Book
Language:	English
Published:	London : McGraw-Hill, 1999
Series:	Electronic packaging and interconnection
Subjects:	Electronic packaging
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