Practical guide to the packaging of electronics : thermal and mechanical design and analysis / Ali Jamnia. thermal and mechanical design and analysis /
Saved in:
Main Author: | Jamnia, Ali, 1961- |
---|---|
Format: | Book |
Language: | English |
Published: |
New York :
Marcel Dekker,
2002.
|
Series: | Mechanical engineering ;
146 |
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
Loading…
Thermal stress and strain in microelectronics packaging / edited by John H. Lau..
Published: (1993)
Published: (1993)
Loading…
Journal of electronic packaging : transactions of the ASME.
Loading…
Journal of electronic packaging transactions of the ASME.
Loading…
Materials for electronic packaging / edited by Deborah D. L. Chung.
Published: (1995)
Published: (1995)
Loading…
Essentials of electronic packaging a multidisciplinary approach / Puligandla Viswanadham.
by: Viswanadham, Puligandla
Published: (2011)
by: Viswanadham, Puligandla
Published: (2011)
Loading…
Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.].
Published: (1998)
Published: (1998)
Loading…
Reliability of electronic packages and semiconductor devices.
by: Di Giacomo, Giulio
Published: (1997)
by: Di Giacomo, Giulio
Published: (1997)
Loading…
Advanced materials for thermal management of electronic packaging Xingcun Colin Tong.
by: Tong, Xingcun Colin
Published: (2011)
by: Tong, Xingcun Colin
Published: (2011)
Loading…
IEEE transactions on electronics packaging manufacturing
Loading…
Electronic packaging : materials and their properties / Michael G. Pecht ... [et al.].
Published: (1999)
Published: (1999)
Loading…
Hermeticity of electronic packages / by Hal Greenhouse.
by: Greenhouse, Hal
Published: (1999)
by: Greenhouse, Hal
Published: (1999)
Loading…
Electronic packaging and interconnection handbook.
by: Harper, Charles A. (Charles Arthur), 1926-
Published: (2000)
by: Harper, Charles A. (Charles Arthur), 1926-
Published: (2000)
Loading…
Materials for high-density electronic packaging and interconnection : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Published: (1990)
Published: (1990)
Loading…
Electronic packaging and production
Loading…
Advanced electronic packaging
Published: (2005)
Published: (2005)
Loading…
The electronic packaging handbook / edited by Glenn R. Blackwell.
Published: (1999)
Published: (1999)
Loading…
ICEPT 2006 proceedings : 7th International Conference on Electronics Packaging Technology chairman, Keyun, Bi.
Published: (2006)
Published: (2006)
Loading…
Proceedings, 2008 International Conference on Electronic Packaging Technology & High Density Packaging ICEPT-HDP 2008 : location, Riverfront Business Hotel, Pudong, Shanghai, China : dates, Monday, July 28 to Thursday, July 31, 2008 / directed by China Institute of Electronics ... [et al.] ; sponsored by China Electronics Packaging Society, of China Institute of Electronics, China (CEPS) ... [et al.] ; organized by China Electronics Packaging Society of China Institute of Electronics (CEPS) ... [et al.] ; co-organized by Hong Kong Applied Science & Technology Research Institute (ASTRI) ... [et al.] ; editors, Keyun Bi, Fei Xiao.
Published: (2008)
Published: (2008)
Loading…
2008 EMAP the 10th International Conference on Electronic Materials and Packaging.
Published: (2008)
Published: (2008)
Loading…
6th International Conference on Electronic Packaging Technology La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 / sponsored by Chinese Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with, IEEE-CPMT (USA) ... [et al.].
Published: (2006)
Published: (2006)
Loading…
Electronic Packaging Technology, 2007, ICEPT 2007, 8th International Conference on date, 14-17 Aug., 2007.
Published: (2007)
Published: (2007)
Loading…
Chip scale package (CSP) : design, materials, processes, reliability, and applications / John Lau, Shi-Wei Ricky Lee.
by: Lau, John H.
Published: (1999)
by: Lau, John H.
Published: (1999)
Loading…
Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... (et al.)..
Published: (1994)
Published: (1994)
Loading…
Manufacturing challenges in electronic packaging / [edited by]Y.C. Lee and W.T. Chen.
Published: (1998)
Published: (1998)
Loading…
Electronic Materials and Packaging, 2007, EMAP 2007, International Conference on date, 19-22 Nov. 2007.
Published: (2007)
Published: (2007)
Loading…
Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on date, 11-14 Dec. 2006.
Published: (2006)
Published: (2006)
Loading…
Package design : an introduction to the art of packaging / Laszlo Roth.
by: Roth, Lászlo
Published: (1981)
by: Roth, Lászlo
Published: (1981)
Loading…
Electronic packaging and interconnection handbook / Charles A. Harper, editor-in-chief.
Published: (1996)
Published: (1996)
Loading…
The package design book.
Published: (2020)
Published: (2020)
Loading…
IEEE transactions on advanced packaging.
Loading…
IEEE transactions on advanced packaging.
Loading…
2007 9th Electronics Packaging Technology Conference 10-12 December 2007, Singapore.
Published: (2007)
Published: (2007)
Loading…
IEEE transactions on components and packaging technologies
Loading…
Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 / sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett..
Published: (1992)
Published: (1992)
Loading…
IEEE transactions on components, packaging, and manufacturing technology.
Loading…
IEEE transactions on components, packaging, and manufacturing technology
Loading…
IEEE transactions on components, packaging, and manufacturing technology
Loading…
IEEE transactions on components, packaging, and manufacturing technology
Loading…
IEEE transactions on components, packaging, and manufacturing technology
Loading…
Experimental packaging
by: Mason, Daniel
Published: (2001)
by: Mason, Daniel
Published: (2001)
Similar Items
-
Thermal stress and strain in microelectronics packaging / edited by John H. Lau..
Published: (1993) - Journal of electronic packaging : transactions of the ASME.
- Journal of electronic packaging transactions of the ASME.
-
Materials for electronic packaging / edited by Deborah D. L. Chung.
Published: (1995) -
Essentials of electronic packaging a multidisciplinary approach / Puligandla Viswanadham.
by: Viswanadham, Puligandla
Published: (2011)