Electronic Materials and Packaging, 2007, EMAP 2007, International Conference on date, 19-22 Nov. 2007. date, 19-22 Nov. 2007.

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Bibliographic Details
Corporate Author: International Symposium on Electronic Materials and Packaging
Format: eBook
Language:English
Published: Piscataway, N.J. : IEEE, c2007.
Subjects:
Electronic packaging > Congresses.
Electronics > Materials > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4489832
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