IEEE workshop on signal propagation on interconnects Avignon, France, Components, Packaging & Manufacturing Technology Society Technical Committee on Electrical Design, Modeling and Simulation, & IEEE Computer Society Technical Council on Test Technology. (2008). Workshop program, 12th IEEE workshop on signal propagation on interconnects May 12-15, 2008, Popes' Palace, Avignon, France / [sponsored by IEEE components, packaging and manufacturing technology society (CPMT), technical committee on electrical design, modeling and simulation (TC-EDMS), and by IEEE Computer Society, Test Technology Technical Council (TTTC)]: May 12-15, 2008, Popes' Palace, Avignon, France. IEEE Xplore.
Chicago Style (17th ed.) CitationIEEE workshop on signal propagation on interconnects Avignon, France, Packaging & Manufacturing Technology Society Technical Committee on Electrical Design Components, and IEEE Computer Society Technical Council on Test Technology. Workshop Program, 12th IEEE Workshop on Signal Propagation on Interconnects May 12-15, 2008, Popes' Palace, Avignon, France / [sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS), and by IEEE Computer Society, Test Technology Technical Council (TTTC)]: May 12-15, 2008, Popes' Palace, Avignon, France. [Piscataway, N.J.]: IEEE Xplore, 2008.
MLA (9th ed.) CitationIEEE workshop on signal propagation on interconnects Avignon, France, et al. Workshop Program, 12th IEEE Workshop on Signal Propagation on Interconnects May 12-15, 2008, Popes' Palace, Avignon, France / [sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS), and by IEEE Computer Society, Test Technology Technical Council (TTTC)]: May 12-15, 2008, Popes' Palace, Avignon, France. IEEE Xplore, 2008.