International Workshop on Thermal Investigations of ICs and Microstructures Rome, Italy, CMP (Firm), Institute of Electrical and Electronics Engineers, & Components, Packaging & Manufacturing Technology Society. (2008). Collection of papers presented at the 14th International Workshop on Thermal Investigation of ICs and Systems Rome, Italy, 24-26 September 2008 / sponsored by CMP, IEEE, CPMT: Rome, Italy, 24-26 September 2008. IEEE.
Chicago Style (17th ed.) CitationInternational Workshop on Thermal Investigations of ICs and Microstructures Rome, Italy, CMP (Firm), Institute of Electrical and Electronics Engineers, and Packaging & Manufacturing Technology Society Components. Collection of Papers Presented at the 14th International Workshop on Thermal Investigation of ICs and Systems Rome, Italy, 24-26 September 2008 / Sponsored by CMP, IEEE, CPMT: Rome, Italy, 24-26 September 2008. [Piscataway, N.J.]: IEEE, 2008.
MLA (9th ed.) CitationInternational Workshop on Thermal Investigations of ICs and Microstructures Rome, Italy, et al. Collection of Papers Presented at the 14th International Workshop on Thermal Investigation of ICs and Systems Rome, Italy, 24-26 September 2008 / Sponsored by CMP, IEEE, CPMT: Rome, Italy, 24-26 September 2008. IEEE, 2008.