Collection of papers presented at the 14th International Workshop on Thermal Investigation of ICs and Systems Rome, Italy, 24-26 September 2008 / sponsored by CMP, IEEE, CPMT.

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Bibliographic Details
Corporate Authors: International Workshop on Thermal Investigations of ICs and Microstructures Rome, Italy, CMP (Firm), Institute of Electrical and Electronics Engineers, Components, Packaging & Manufacturing Technology Society
Format: eBook
Language:English
Published: [Piscataway, N.J.] : IEEE, c2008.
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Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4663477
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