Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana / sponsored by the Electronic and Photonic Packaging Division, ASME. presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana /

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Bibliographic Details
Corporate Authors: Proceedings of Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology New Orleans, La., American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Format: eBook
Language:English
Published: New York : American Society of Mechanical Engineers, c2002.
Series:EPP (Series) ; v. 2.
Subjects:
Electronic packaging > Congresses.
Photonics > Congresses.
Nanotechnology > Congresses.
Microelectronic packaging > Congresses.
Surface mount technology > Congresses.
Microelectromechanical systems > Congresses.
Integrated circuits > Wafer-scale integration > Congresses.
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