Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana / sponsored by the Electronic and Photonic Packaging Division, ASME. presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana /

Saved in:
Bibliographic Details
Corporate Authors: Proceedings of Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology New Orleans, La., American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Format: eBook
Language:English
Published: New York : American Society of Mechanical Engineers, c2002.
Series:EPP (Series) ; v. 2.
Subjects:
Electronic packaging > Congresses.
Photonics > Congresses.
Nanotechnology > Congresses.
Microelectronic packaging > Congresses.
Surface mount technology > Congresses.
Microelectromechanical systems > Congresses.
Integrated circuits > Wafer-scale integration > Congresses.
Tags: Add Tag
No Tags, Be the first to tag this record!

MARC

LEADER 00000cam a22000007al4500
001 001251762
005 20190624153018.0
006 m
008 030619s2002 nyua b 101 0 eng d
007 cr||||||||||||
009 a20032714185UkMaC
010 |a 2003271418 
020 |a 0791836487 
020 |a 9780791836484 
111 2 |a Proceedings of Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology  |d 2002 :  |c New Orleans, La.) 
245 0 0 |a Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology  |h [electronic resource] :  |b presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana /  |c sponsored by the Electronic and Photonic Packaging Division, ASME. 
260 |a New York :  |b American Society of Mechanical Engineers,  |c c2002. 
300 |a xiii, 572 p. :  |b ill. ;  |c 28 cm. 
490 1 |a EPP ;  |v vol. 2 
500 |a Login to VPN Client for off campus access. 
504 |a Includes bibliographical references and index. 
650 0 |a Electronic packaging  |v Congresses. 
650 0 |a Photonics  |v Congresses. 
650 0 |a Nanotechnology  |v Congresses. 
650 0 |a Microelectronic packaging  |v Congresses. 
650 0 |a Surface mount technology  |v Congresses. 
650 0 |a Microelectromechanical systems  |v Congresses. 
650 0 |a Integrated circuits  |x Wafer-scale integration  |v Congresses. 
710 2 |a American Society of Mechanical Engineers.  |b Electronic and Photonic Packaging Division. 
711 2 |a International Mechanical Engineering Congress and Exposition  |d (2002 :  |c New Orleans, La.) 
830 0 |a EPP (Series) ;  |v v. 2. 
952 |0 0  |1 0  |4 0  |7 0  |9 843437  |a ONLINE  |b ONLINE  |c EB  |d 2016-05-20  |l 0  |p B498902  |r 2018-02-01 00:00:00  |w 2018-02-01  |y ONLINE 
999 |c 522958  |d 522958 

Similar Items