Advanced thermal management materials / Guosheng Jiang, Liyong Diao, Ken Kuang.

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Bibliographic Details
Main Author: Jiang, Guosheng
Other Authors: Diao, Liyong, Kuang, Ken
Format: Book
Language:English
Published: New York ; London : Springer, c2013.
Subjects:
Microelectronic packaging > Materials > Thermal properties.
Microelectronics > Cooling.
Heat sinks (Electronics)
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