Mechanical relaxation of residual stresses Leonard Mordfin, editor.

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Bibliographic Details
Corporate Authors: International Symposium on Mechanical Relaxation of Residual Stresses Cincinnati, Ohio, American Society for Testing and Materials. Committee E-28 on Mechanical Testing
Other Authors: Mordfin, Leonard (ed.)
Format: eBook
Language:English
Published: Philadelphia, Pa. : American Society for Testing and Materials, c1988.
Series:Journal of ASTM International. Selected technical papers. STP 993.
Subjects:
Online Access:https://compass.astm.org/document/?contentCode=ASTM%7CSTP993-EB%7Cen-US&proxycl=https%3A%2F%2Fsecure.astm.org&fromLogin=true
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