Symposium on Current Trends in Protective Packaging of Computers and Electronic Components Phoenix, Ariz, American Society for Testing and Materials, ASTM Committee D-10 on Packaging, Peache, R. J., & O'Sullivan, D. (1988). Current trends in protective packaging of computers and electronic components Robert J. Peache and Denis O'Sullivan, editors. American Society for Testing and Materials.
Chicago Style (17th ed.) CitationSymposium on Current Trends in Protective Packaging of Computers and Electronic Components Phoenix, Ariz, American Society for Testing and Materials, ASTM Committee D-10 on Packaging, Robert J. Peache, and Denis O'Sullivan. Current Trends in Protective Packaging of Computers and Electronic Components Robert J. Peache and Denis O'Sullivan, Editors. Philadelphia, Pa.: American Society for Testing and Materials, 1988.
MLA (9th ed.) CitationSymposium on Current Trends in Protective Packaging of Computers and Electronic Components Phoenix, Ariz, et al. Current Trends in Protective Packaging of Computers and Electronic Components Robert J. Peache and Denis O'Sullivan, Editors. American Society for Testing and Materials, 1988.