Relative contributions of packaging elements to the thermal hysteresis of a MEMS pressure sensor

Piezoresistive silicon pressure sensor samples were thermally cycled after being consecutively packaged to three different levels. These started with the absolute minimum to allow measurement of the output and with each subsequent level incorporating additional packaging elements within the build. F...

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Bibliographic Details
Main Authors: Youssef Hamid, David Hutt, David Whalley, Russell Craddock
Format: Default Article
Published: 2020
Subjects:
Ecology not elsewhere classified
packaging levels
consecutive packaging
piezoresistive pressure sensor
thermal hysteresis
polynomial fitting
Ecology
Online Access:https://hdl.handle.net/2134/12034851.v1
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https://hdl.handle.net/2134/12034851.v1

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