Effects of packaging elements on the thermal hysteresis of piezoresistive pressure sensors

Effects of packaging elements on the thermal hysteresis of piezoresistive pressure sensors

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Bibliographic Details
Main Author: Youssef Hamid
Format: Default Thesis
Published: 2021
Subjects:
Mechanical engineering not elsewhere classified
piezoresistive pressure sensor
thermal hysteresis
packaging levels
consecutive packaging
polynomial fitting
finite element analysis
creep
Mechanical Engineering not elsewhere classified
Online Access:https://dx.doi.org/10.26174/thesis.lboro.15060501
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https://dx.doi.org/10.26174/thesis.lboro.15060501

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