Liu, C., Liu, A., Jiang, H., Liang, S., Zhou, Z., & Liu, C. (2022). Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging.
Chicago Style (17th ed.) CitationLiu, Canyu, Allan Liu, Han Jiang, Shuibao Liang, Zhaoxia Zhou, and Changqing Liu. Self-propagating Exothermic Reaction Assisted Cu Clip Bonding for Effective High-power Electronics Packaging. 2022.
MLA (9th ed.) CitationLiu, Canyu, et al. Self-propagating Exothermic Reaction Assisted Cu Clip Bonding for Effective High-power Electronics Packaging. 2022.
Warning: These citations may not always be 100% accurate.