Microwave assisted processing of metal loaded inks and pastes for electronic interconnect applications

Isotropically conductive adhesives (ICAs) and inks are potential candidates for low cost interconnect materials and widely used in electrical/electronic packaging applications. Silver (Ag)filled ICAs and inks are the most popular due to their high conductivity and good reliability. However, the pric...

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Bibliographic Details
Main Author: Siyuan Qi
Format: Default Thesis
Published: 2014
Subjects:
Materials engineering not elsewhere classified
Conductive adhesives
Copper nano inks
Microwave processing
Resin curing mechanisms
Sintering
Conductivity
Interconnects
Materials Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/16118
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https://hdl.handle.net/2134/16118

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