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Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnects
The control of interfacial microstructural stability is of utmost importance to the reliability of liquid solder interconnects in high temperature electronic assemblies. This is primarily due to excessive intermetallic compounds (IMCs) that can form and continuously grow during high temperature oper...
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| Main Authors: | , , , , |
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| Format: | Default Article |
| Published: |
2015
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/19475 |
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