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Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnects

The control of interfacial microstructural stability is of utmost importance to the reliability of liquid solder interconnects in high temperature electronic assemblies. This is primarily due to excessive intermetallic compounds (IMCs) that can form and continuously grow during high temperature oper...

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Bibliographic Details
Main Authors:	Jing Wang, Geoffrey Wilcox, Roger J. Mortimer, Changqing Liu, Mark Ashworth
Format:	Default Article
Published:	2015
Subjects:	Other chemical sciences not elsewhere classified untagged Chemical Sciences not elsewhere classified
Online Access:	https://hdl.handle.net/2134/19475
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