Electromigration time-to-failure analysis using a lumped element model

This thesis presents a theoretical and computer simulation of electromigration behaviour in the Integrated Circuit (IC) interconnection, with a particular emphasis on the analysis of the time-to-failure (TTF) produced through the Lumped Element model. The current and most accepted physical model for...

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Bibliographic Details

Main Author:	Wan S. Wan Ismail
Format:	Default Thesis
Published:	2001
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/33653
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