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Glass multilayer bonding for high density interconnect substrates

The aim of this research was the investigation of bonding borosilicate glass sheets, its trade mark CMZ, 100μm thickness, to create multilayer substrates capable of supporting high-density electrical interconnections. CMZ glass was chosen as it has a coefficient of thermal expansion that is close to...

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Bibliographic Details
Main Author:	Fuad Mohamed Hassan Khoshnaw
Format:	Default Thesis
Published:	2010
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/6463
Tags:	Add Tag No Tags, Be the first to tag this record!

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