A process model of the infra-red reflow soldering of printed circuit board assemblies

This paper presents the latest results of an evolving model of the infra-red reflow soldering process. Recent additions to earlier models are the convective cooling of the PCB as it exits from the furnace muffle, and the addition of realistic component structures to the PCB assembly. The paper also...

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Bibliographic Details

Main Authors:	David Whalley, Adebayo Oluyinka Ogunjimi, Paul Conway, David Williams
Format:	Default Text
Published:	1991
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/3861
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