Thermal design of high power semiconductor packages for aircraft electronic systems
The More Electric Aircraft is likely to require more extensive use of power electronics, for which thermal management will be a key issue. This paper presents an approach to designing integrated air cooled heatsinks which is being developed by Loughborough University as part of the CARAD funded Vari...
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| Main Authors: | , |
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| Format: | Default Conference proceeding |
| Published: |
1999
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4196 |
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